Abstract
As-deposited thin films grown by vapor deposition often exhibit large intrinsic stresses that can lead to film failure. While this is an “old” materials problem, our understanding has only recently begun to evolve in a more sophisticated fashion. Sensitive real-time measurements of stress evolution during thin-film deposition reveal a generic compressive-tensile-compressive behavior that correlates with island nucleation and growth, island coalescence, and postcoalescence film growth. In this article, we review the fundamental mechanisms that can generate stresses during the growth of Volmer-Weber thin films. Compressive stresses in both discontinuous and continuous films are generated by surface-stress effects. Tensile stresses are created during island coalescence and grain growth. Compressive stresses can also result from the flux-driven incorporation of excess atoms within grain boundaries. While significant progress has been made in this field recently, further modeling and experimentation are needed to quantitatively sort out the importance of the different mechanisms to the overall behavior.
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References
See references in G.G. Stoney, Proc. R.Soc. London, Ser. A 82 (1909) p. 172.
M.F. Doerner and W.D. Nix, CRC Crit. Rev. Solid State Mater. Sci. 14 (1988) p. 225.
W.D. Nix, Metall. Trans. A 20A (1989) p. 2217.
J.A. Floro and E. Chason, in In Situ RealTime Characterization of Thin Films, edited by O. Auciello and A.R. Krauss (John Wiley & Sons, New York, 2001) p. 191.
P.A. Flinn, D.S. Gardner, and W.D. Nix, IEEE Trans. Electron Devices ED–34 (1987) p. 689.
See the list of references in R. Koch, J. Phys.: Condens. Matter 6 (1994) p. 9519.
J.A. Floro, S.J. Hearne, J.A. Hunter, P. Kotula, E. Chason, S.C. Seel, and C.V. Thompson, J. Appl. Phys. 89 (2001) p. 4886.
A.L. Shull and F. Spaepen, J. Appl. Phys. 80 (1996) p. 6243.
R.C. Cammarata, Prog. Surf. Sci. 46 (1994) p. 1.
R.C. Cammarata, T.M. Trimble, and D.J. Srolovitz, J. Mater. Res. 15 (2000) p. 2468.
While surface stresses are frequently tensile, ß can be either positive or negative depending on the material and crystallographic orientation of the island; see Reference 10.
R.W. Hoffman, Thin Solid Films 34 (1976) p. 185.
W.D. Nix and B.M. Clemens, J. Mater. Res. 14 (1999) p. 3467.
L.B. Freund and E. Chason, J. Appl. Phys. 89 (2001) p. 4866.
K.L. Johnson, Contact Mechanics (Cambridge University Press, Cambridge, UK, 1985).
S.C. Seel, C.V. Thompson, S.J. Hearne, and J.A. Floro, J. Appl. Phys. 88 (2000) p. 7079.
B.W. Sheldon, A. Lau, and A. Rajamani, J. Appl. Phys. 90 (2001) p. 5097.
C.V. Thompson, J. Mater. Res. 8 (1993) p. 237.
C.V. Thompson, Annu. Rev. Mater. Sci. 20 (1990) p. 245.
P. Chaudhari, J. Vac. Sci. Technol. 9 (1972) p. 520.
H. Lee, PhD thesis, Stanford University, 2001.
J.A. Floro, C.V. Thompson, R. Carel, and P.D. Bristowe, J. Mater. Res. 9 (1994) p. 2411.
E.M. Zielinski, R.P. Vinci, and J.C. Bravman, J. Appl. Phys. 76 (1994) p. 4516.
J.E. Sanchez Jr and E. Arzt, Scripta Metall. Mater. 27 (1992) p. 285.
V. Ramaswamy PhD thesis, Stanford University, 2000.
E. Chason, B.W. Sheldon, L.B. Freund, J.A. Floro, and S.J. Hearne, Phys. Rev. Lett. (2001) submitted for publication.
M.D. Thouless, Acta Metall. Mater. 41 (1993) p. 1057.
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Floro, J.A., Chason, E., Cammarata, R.C. et al. Physical Origins of Intrinsic Stresses in Volmer-Weber Thin Films. MRS Bulletin 27, 19–25 (2002). https://doi.org/10.1557/mrs2002.15
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DOI: https://doi.org/10.1557/mrs2002.15