doiSerbia

Effects of pressure and temperature on thermal contact resistance between different materials

Zhao Zhe (Beijing Jiaotong University, Institute of Engineering Mechanics, Beijing, China)
Huang Hai-Ming (Beijing Jiaotong University, Institute of Engineering Mechanics, Beijing, China)
Wang Qing (Durham University, School of Engineering and Computing Sciences, Durham, United Kingdom)
Ji Song (Beijing Jiaotong University, Institute of Engineering Mechanics, Beijing, China)

To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.

Keywords: thermal contact resistance, interfacial temperature, pressure, experiment