Synthesis of Lead-Free Solder Particles Using High-Speed Centrifugal Atomization

Akio Furusawa; Shinnosuke Akiyama; Kazuki Sakai; Yamato Hayashi; Hirotsugu Takizawa

doi:10.2320/matertrans.M2017129

Akio Furusawa, Shinnosuke Akiyama, Kazuki Sakai, Yamato Hayashi, Hirotsugu Takizawa

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Keywords: solder, particle size, centrifugal atomization, disc size, rotation speed, high speed, electronic circuit boards, electronic components

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2017 Volume 58 Issue 10 Pages 1458-1462

DOI https://doi.org/10.2320/matertrans.M2017129

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Abstract

We investigated the relationships between the centrifugal force and the disc size and rotation speed during the production of fine particles. In this study, an empirical formula was developed with the goal of obtaining an average particle size of D50. Moreover, particle production was performed at a disc rotation speed of at least 100,000 rpm, which was greater than that reported in previous studies. Our results showed that with Sn-13 mass%Sb (called Sn-13Sb), the average particle size produced at a disc rotation speed of 115,000 rpm was 12.8 μm, with 96.5% of the particles smaller than 25 μm.

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