The slicing used diamond wire tool is considered as one of effective slicing methods for large size silicon ingot in the near future. As it is not necessary to use slurry with abrasive grains, the working ability after slicing process is good for operators. On the other hand, this method has some weak points such as diamond wire tool is expensive, reuse of broken wire tool is impossible and so on. Therefore, this study aims to develop the more excellent wire tool with regards to slicing ability. This spiral chip-pocket wire tool has such characteristics electrodeposited diamond grains in spiral on the core wire. In this report is described the outline of plating apparatus and the trial manufacturing method of spiral diamond wire tool. Behavior of breaking load, slicing ability and slicing accuracy of the trial manufacturing wire tool are studied through a series of experiments. It is clear that the trial manufacturing wire tool has high slicing ability, long-life and high strength compared with the ordinary diamond wire tool.