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Investigating the grain structure of Cu-Al and Cu-Mn alloys via electron backscatter diffraction and optical metallography

  • Proceedings of the International Symposium “Ordering in Minerals and Alloys” OMA-16 and Proceedings of the International Symposium “Order, Disorder, and Properties of Oxides” ODPO-16
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Bulletin of the Russian Academy of Sciences: Physics Aims and scope

Abstract

Parameters of grain-boundary ensembles of Cu-Al and Cu-Mn solid solutions are analyzed quantitatively by optical metallography and scanning electron microscopy with the use of backscattering electron diffraction. It is established by both methods that the fraction of all special boundaries in a grain boundary ensemble and the fraction of twin boundaries Σ3 in the spectrum of special boundaries increase as the tacking fault energy in substitutional solid solutions diminishes.

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Correspondence to E. V. Konovalova.

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Original Russian Text © E.V. Konovalova, O.B. Perevalova, N.A. Koneva, K.V. Ivanov, E.V. Kozlov, 2014, published in Izvestiya Rossiiskoi Akademii Nauk. Seriya Fizicheskaya, 2014, Vol. 78, No. 4, pp. 384–387.

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Konovalova, E.V., Perevalova, O.B., Koneva, N.A. et al. Investigating the grain structure of Cu-Al and Cu-Mn alloys via electron backscatter diffraction and optical metallography. Bull. Russ. Acad. Sci. Phys. 78, 253–256 (2014). https://doi.org/10.3103/S1062873814040182

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  • DOI: https://doi.org/10.3103/S1062873814040182

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