Abstract
The effect of low temperature recovery treatments on recrystallization kinetics during subsequent annealing was examined using a simple physically-based model. The results suggest that recovery may accelerate recrystallization in high stacking fault energy materials. Otherwise, recovery is expected to retard recrystallization by reducing the driving force for the nucleation and growth of recrystallized grains. These calculations help reconcile a number of apparently conflicting reports on the effect of recovery on recrystallization.
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