Effect of Ni-based conversion coating and Ni–P electroless plating on the bonding process of pure Al and AZ31 alloy

Jinchuan Jie; Jialei Zhao; Hang Chen; Ying Fu; Zhiqiang Cao; Tingju Li

doi:10.3139/146.111046

Published by De Gruyter May 8, 2014

Effect of Ni-based conversion coating and Ni–P electroless plating on the bonding process of pure Al and AZ31 alloy

Jinchuan Jie , Jialei Zhao , Hang Chen , Ying Fu , Zhiqiang Cao and Tingju Li

From the journal International Journal of Materials Research

https://doi.org/10.3139/146.111046

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Abstract

For the first time, the present study investigates the preparation of Al/Mg bimetal using Ni-based conversion plating and Ni–P electroless plating by means of diffusion bonding. In this study, AZ31 alloy was coated with an Ni-based interlayer by conversion plating and an Ni–P interlayer by electroless plating; the Al/Mg bimetallic materials were prepared by diffusion bonding in an air atmosphere. For conversion plating, the thickness of the Ni-based layer is several hundred nanometers. When heat-treated at 450 °C for 90 min, most of the interfaces between Al and AZ31 alloy bond together well. For electroless plating, the thickness of the Ni – P layer is about 10 μm for a plating time of 60 min. When heat-treated at 450 °C for 150 min, good bonding between pure Al and AZ31 can be obtained.

Keywords: Aluminum; Magnesium alloys; Ni–P; Conversion coating; Electroless plating

* Correspondence address, Dr. Jie Jinchuan, Laboratory of Special Processing of Raw Materials and School of Material Science and Engineering, Dalian University of Technology, Linggong Road 2, Dalian, Liaoning 116024, China, Tel.: +86 0411 84708940, Fax: +86 0411 84708940, E-mail: tjuli@dlut.edu.cn

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Received: 2013-09-26

Accepted: 2013-12-12

Published Online: 2014-05-08

Published in Print: 2014-05-13

Effect of Ni-based conversion coating and Ni–P electroless plating on the bonding process of pure Al and AZ31 alloy

Abstract

References

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