Research on Chip Formation Mechanisms of Nano-Composite Ceramics in Two-Dimensional Ultrasonic Grinding

Jing Lin Tong; Bo Zhao; Yan Yan Yan

doi:10.4028/www.scientific.net/KEM.416.614

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Comparisons of Surface Roughness for Precision Ground Different Brittle Materials
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Machining Performance on Multi-Layer Brazed Diamond Tools
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Detection and Recognition of Steel Ball Surface Defect Based on MATLAB
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High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective
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Research on Chip Formation Mechanisms of Nano-Composite Ceramics in Two-Dimensional Ultrasonic Grinding
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Research on the Surface/Subsurface Damages of ZTA Ceramics under Two-Dimensional Ultrasonic Vibration Assisted Grinding
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Research on Chip Formation Mechanisms of Nano-Composite Ceramics in Two-Dimensional Ultrasonic Grinding

Abstract:

Experimental research on grinding characteristics of nano-composites ceramics were carried out using diamond wheel in two-dimensional ultrasonic vibration grinding (TDUVG) and the topography of the scratched grooves were observed with Transmission Electron Microscope. The surface crack, plastic deformation and brittle-ductile transition during chip formation were analyzed. Subsequently, the grinding model of nano-composites ceramics machining in TDUVG was established based on fracture theory of micro-indentation in fracture region and plastic information mechanism of hard-brittle materials. The metamorphic layer can be divided into three regions: brittle-fracture, non-elastic deformation and residual damage region. Ultrasonic grinding process can be divided into three phase: elastic friction and extrusion, crack growth and crack propagation and chip formation.

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Periodical:

Key Engineering Materials (Volume 416)

Pages:

614-618

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.416.614

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Online since:

September 2009

Authors:

Jing Lin Tong, Bo Zhao, Yan Yan Yan

Keywords:

Al₂O₃-ZrO₂ Nanocomposite Ceramic, Chip Formation, Grinding Model, Plastic Deformation, Two Dimensional Ultrasonic Vibration Grinding (TDUVG)

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