Effect of Load and Interface Materials on Thermal Contact Resistance between Similar and Dissimilar Materials

Swamy R. Narayana; Prabhu K. Narayan

doi:10.4028/www.scientific.net/AMM.592-594.1493

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 592-594Effect of Load and Interface Materials on Thermal...

Effect of Load and Interface Materials on Thermal Contact Resistance between Similar and Dissimilar Materials

Abstract:

The thermal contact resistance (TCR) between similar and dissimilar materials (copper, aluminium, brass and type 304 stainless steel) was assessed. Copper foil, aluminium foil, lead and Sn-9Zn lead free solder were selected as thermal interface materials (TIMs). The interfacial contact pressure was varied by application of load on materials in contact. The interfacial heat flux was estimated by solving the inverse heat conduction problem (IHCP). At higher load, the temporal variation of thermal contact resistance showed early occurrence of peak and lower values of TCR. The use of thermal interface materials reduced the contact resistance between the hot source and cold sink materials. Among the interface materials used, Sn-9Zn lead free solder showed the lowest contact resistance. This was attributed to the solid to liquid phase transformation at higher temperatures and the conformance of the interface material to surfaces in contact. Factorial experiments were carried out to determine the significance of experimental variables on TCR. The analysis showed that the effect of applied load on TCR was significant compared to other parameters.

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Periodical:

Applied Mechanics and Materials (Volumes 592-594)

Pages:

1493-1497

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.592-594.1493

Citation:

Cite this paper

Online since:

July 2014

Authors:

Swamy R. Narayana*, Prabhu K. Narayan

Keywords:

Factorial Experiments, Inverse Heat Conduction Problem (IHCP), Lead Free Solder, Load, Thermal Contact Resistance (TCR), Thermal Interface Material (TIM)

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