Laser Cutting of Thin Aluminum and Silicon Alloy: Influence of Laser Power on Kerf Width

Bekir Sami Yilbas; S.S. Akhtar; E. Bayraktar; Zuhair M. Gasem

doi:10.4028/www.scientific.net/AMR.445.442

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 445Laser Cutting of Thin Aluminum and Silicon Alloy:...

Laser Cutting of Thin Aluminum and Silicon Alloy: Influence of Laser Power on Kerf Width

Abstract:

Laser cutting of aluminum-silicon sheet is carried out. The influence of laser output power on the kerf width is examined in details. The lump parameter analysis is introduced to predict the kerf width size. The percentage of kerf width size variation due to different laser output power levels is formulated. It is found that the kerf width size predicted agrees well with the experimental data. The influence of laser output power on the kerf width size is more pronounced for power levels 350 W. Keywords: laser cutting, aluminum-silicon, kerf width

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Periodical:

Advanced Materials Research (Volume 445)

Pages:

442-447

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.445.442

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Online since:

January 2012

Authors:

Bekir Sami Yilbas, S.S. Akhtar, E. Bayraktar, Zuhair M. Gasem

Keywords:

Aluminum-Silicon, Kerf Width, Laser Cutting

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