Heat Sink Materials Processing by Pulse Plasma Sintering

Łukas Ciupiński; D. Siemiaszko; Marcin Rosiński; Andrzej Michalski; Krzysztof Jan Kurzydlowski

doi:10.4028/www.scientific.net/AMR.59.120

Paper Titles

Impact Bending Tests on Selected Refractory Materials
p.101

Improved Mechanical Properties of Ti₂AlNb-Based Intermetallic Alloys and Composites
p.105

Diamond-Based Metal Matrix Composites for Thermal Management Made by Liquid Metal Infiltration — Potential and Limits
p.111

Comparative Study of Predictive Finite Element Methods for Mechanical Properties in 2D Woven Carbon/Carbon Composites
p.116

Heat Sink Materials Processing by Pulse Plasma Sintering
p.120

Surface Modification of Diamonds in Diamond/Al-Matrix Composite
p.125

Carbon Nanotubes as Highly Conductive Nano-Fillers in Metallic Matrices
p.131

Influence of Different Deposition Parameters on the Performance of a Ti-Ta-C Interface Layer in SiC-Fiber Reinforced Copper Matrix Composites
p.138

Diamond Composites for Power Electronics Application
p.143

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Heat Sink Materials Processing by Pulse Plasma Sintering

Abstract:

A Pulse Plasma Sintering (PPS) process was employed to manufacture Cu-diamond composites with a 50% volume fraction of each constituent. Pure and Cr (0.8wt.%) alloyed copper matrices were used and commercial diamond powders. The composites were sintered at temperature of 900°C for 20 min and under pressure of 60 MPa. In these sintering conditions diamond becomes thermodynamically unstable. Cu0.8Cr-diamond and Cu-diamond composites with relative densities of 99,7% and 96% respectively were obtained. The thermal conductivity of Cu0.8Cr-diamond composite is equal to 640 W(mK)-1 whereas that of Cu-diamond is 200 W(mK)-1. The high thermal conductivity and relative density of Cu0.8Cr-diamond composite is due to the formation of a thin chromium carbide layer at the Cu-diamond interface.