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Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250°C
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Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Study of Grain-Boundary Diffusion of Au in Copper...

Study of Grain-Boundary Diffusion of Au in Copper within ∑5 Misorientation Range in the Context of Structure of Grain Boundaries

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

21-34

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.21

Citation:

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Online since:

February 1998

Authors:

E. Budke, Christian Herzig, S.I. Prokofjev, Lasar S. Shvindlerman

Keywords:

Copper Bicrystals, Grain Boundary Diffusion, Grain Boundary Structure, Mechanism of Grain Boundary Diffusion, Misorientation Dependence

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