Using Nanoindentation and Nanoscratch to Determine Thin Film Mechanical Properties

Rwei Ching Chang; Feng Yuan Chen; Chang En Sun

doi:10.4028/www.scientific.net/KEM.326-328.357

Paper Titles

Parallel Computation of Large-Scale Molecular Dynamics Simulations
p.341

Design of a Rubber Membrane under Substrate for Nanoimprint Lithography Process
p.345

Simulation Assisted Measurement of Nanoparticle Concentration Generated during High-Density Plasma CVD of Poly-Silicon Films
p.349

Tribological Performance of Ordered Mesoporous Carbons in Mineral Oils Under Boundary Lubricated Sliding
p.353

Using Nanoindentation and Nanoscratch to Determine Thin Film Mechanical Properties
p.357

Estimation of Elastic-Plastic Tensile Properties Using Nano-Indentation Tests and FE Simulations
p.361

Fabrication and I-V Characteristics of Nanocrystalline Titania Electrode Sensitized by Zinc Phthalocyanine
p.365

The Size and Morphology of Fine CaB₆ Powder Synthesized by Nanometer CaCO₃ as Reactant
p.369

Scanning Tunneling Microscopy Studies of Porous and Oxidized Zn
p.373

HomeKey Engineering MaterialsKey Engineering Materials Vols. 326-328Using Nanoindentation and Nanoscratch to Determine...

Using Nanoindentation and Nanoscratch to Determine Thin Film Mechanical Properties

Abstract:

This work uses nanoindentation and nanoscratch to measure the mechanical properties of evaporation copper thin films. The thin film is deposited on a silicon wafer substrate by using the physical vapor deposition method provided by a resistive heating evaporator. The mechanical properties are then determined by indentation test and lateral force test produced by nanoindenter and nanoscratch. The results show that, as the copper thin film is 500nm in thickness and the indentation depth increases from 100nm to 400nm, the Young’s modulus increases from 151GPa to 160GPa while the hardness increases from 2.8GPa to 3.5GPa. Moreover, both the Young’s modulus and the hardness decrease as the thickness of the thin film increases. Besides, the nanoscratch results show that the friction factor also increases as the scratch depth increases, and a thinner film thickness makes a larger friction factor. The results represent the substrate has a significant effect on the mechanical properties of the thin films.