Magnetron Sputtering of NiCr/NiSi Thin-Film Thermocouple Sensor for Temperature Measurement when Machining Chemical Explosive Material

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Abstract:

Temperature plays a vital role in the machining industry today. A Nickel-Chrome versus Nickel-Silicon thin-film thermocouple system has been established for measuring instantaneous workpiece temperature in chemical explosive material machining. The NiCr/NiSi thin-film thermocouples have been deposited inside high speed steel cutters by magnetron sputtering. The typical deposition conditions are summarized. Static and dynamic calibrations of the NiCr/NiSi thin-film thermocouples are presented. The Seebeck coefficient of the TFTC is 40.4 μV/°C which is almost the same as that of NiCr/NiSi wire thermocouple. The response time is about 0.42ms. The testing results indicate that the developed NiCr/NiSi thin-film thermocouple sensors can respond fast enough to catch the very short temperature pulse and perform excellently when machining chemical explosive material in situ.

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Periodical:

Key Engineering Materials (Volumes 467-469)

Pages:

134-139

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Online since:

February 2011

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[1] D. Burgess, M. Yust and K. G. Kreider: Sensors and Actuators A, vol. 24(1990), pp.155-161.

Google Scholar

[2] M. Yust and K. G. Kreider: Thin Solid Films, vol. 176(1989), pp.73-77.

Google Scholar

[3] K. G. Kreider: J. Vac. Sci. Technol. A, vol. 11(1993), pp.1401-1405.

Google Scholar

[4] K. G. Kreider: J. Vac. Sci. Technol. A, vol. 4(1986), pp.2618-2623.

Google Scholar

[5] D. Assanis and A. Friedmann: International Communications in Heat and Mass Transfer, vol 20(1993), pp.459-468.

Google Scholar

[6] Q.Y. Zeng, B.Y. Sun, X. Deng, J. Xu and Y. Jia: Journal of Manufacturing Science and Engineering, Vol. 128 (2006), pp.175-179.

Google Scholar

[7] P. Bulkin, P . Swart and B. Lacquet: J. Non-cryst. Solids, vol. 226(1998), pp.58-66.

Google Scholar

[8] H. Bartzsch, D. Glöß and B. Böchet: Surf. Coat. Tech., vol. 174-175(2003), pp.774-778.

Google Scholar

[9] B. Serio, Ph. Nika, J. P. Prenel: Rev. Sci. Instrum. vol. 71 (2000), pp.4306-4313.

Google Scholar

[10] K. G. Kreider, D.C. Ripple, D. P. Dewitt: Proceedings of the International Symposium, vol. 44 (1998), pp.561-570.

Google Scholar

[11] Marcio Bacci da Silva, James Wallbank: J. Mater. Process Tech. vol. 88 (1999) , pp.195-202.

Google Scholar