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HomeKey Engineering MaterialsKey Engineering Materials Vols. 609-610A Novel Nanoparticles Activation Technique for...

A Novel Nanoparticles Activation Technique for Electroless Plating on ABS Plastic

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Abstract:

This paper reports a novel and facile activation process for electroless copper plating on Acrylonitrile Butadiene Styrene (ABS) plastic substrate using gold nanoparticles as catalyst. Gold nanoparticles were prepared by chemical reduction method and characterized by UVvisible adsorption spectrum and transmission electron microscope (TEM). The gold nanoparticles were sphere-like with a size of less than 50 nm. Gold nanoparticles were adsorbed on ABS surface and acted as nucleation centers in activating process of the electroless copper plating. The uniform and dense film was obtained at the optimal technological parameters which were achieved by the orthogonal experiment. The scanning electron microscope (SEM), energy dispersive spectrometer (EDS), X-ray diffractometer (XRD) and X-ray photoelectron spectroscopy (XPS) were used to detect the morphology, structure and elemental composition of the coating, respectively. The results indicated that copper coating contained only Cu (0) without any other elements.

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Micro-Nano Technology XV

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Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

55-63

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.609-610.55

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Online since:

April 2014

Authors:

Hong Fang Ma*, Fang Ma, Hua Sun, Xiaor Rui Wang, Rong Yan Jiang, Chang Cun Zhang

Keywords:

ABS Plastic, Activation, Electroless Plating, Gold Nanoparticle

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* - Corresponding Author

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