Molecular Dynamics Study of Abrasive Grain Morphology and Orientation in Nanometric Grinding

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Abstract:

A simulation of the material removal by a single abrasive grain in nanometric grinding is presented in this paper. Molecular Dynamics method is used for modeling the diamond grain and the copper workpiece. The Morse potential function is used to simulate the interactions between the atoms involved in the procedure. The abrasive grain follows a trajectory with decreasing depth of cut within the workpiece to simulate the interaction of the grain with the workpiece. The influence of the grain shape, being either square or rectangular, and of the orientation of the grain, where the grain has rake angle 10o, -10o and-20o, are studied. From the analysis it is apparent that both grain morphology and orientation play a significant role on chip formation, grinding forces and temperatures. With the appropriate modifications, the proposed model can be used for the simulation of various nanomachining processes and operations, in which continuum mechanics cannot be applied or experimental techniques are subjected to limitations.

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7-12

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February 2016

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[1] A.G. Mamalis, J. Kundrak, K. Gyani, M. Horvath, On the precision grinding of advanced ceramics, International Journal of Advanced Manufacturing Technology 20 (2002) 255–258.

DOI: 10.1007/s001700200150

Google Scholar

[2] J. Kundrak, K. Gyani, V. Bana, Roughness of ground and hard-turned surfaces on the basis of 3D parameters, International Journal of Advanced Manufacturing Technology 38 (2008) 110-119.

DOI: 10.1007/s00170-007-1086-9

Google Scholar

[3] J. Kundrák, Z. Gácsi, K. Gyáni, V. Bana, G. Tomolya, X-ray diffraction investigation of white layer development in hard-turned surfaces, International Journal of Advanced Manufacturing Technology 62 (2012) 457–469.

DOI: 10.1007/s00170-011-3811-7

Google Scholar

[4] M.N. Durakbasa, G. Bas, Key Metrology Roadmap in Advanced Manufacturing Technology of Micro-components and Nano-structures, International Journal of Mechanical Engineering and Automation 1(6) (2014) 347 - 353.

Google Scholar

[5] B. Karpuschewski, K. Schmidt, J. Beňo, I. Maňková, J. Prilukova, Measuring procedures of cutting edge preparation when hard turning with coated ceramics tool inserts, Measurement 55 (2014) 627-640.

DOI: 10.1016/j.measurement.2014.06.008

Google Scholar

[6] L. Kandráč, I. Maňková, M. Vrabeľ, J. Beňo, Finite element simulation of cutting forces in orthogonal machining of titanium alloy Ti-6Al-4V, Applied Mechanics and Materials 474 (2014) 192-199.

DOI: 10.4028/www.scientific.net/amm.474.192

Google Scholar

[7] P. Niesłony, W. Grzesik, R. Chudy, W. Habrat, Meshing strategies in FEM simulation of the machining process, Archives of Civil and Mechanical Engineering 15 (2015) 62-70.

DOI: 10.1016/j.acme.2014.03.009

Google Scholar

[8] B. Slodki, W. Zebala, G. Struzikiewicz, Correlation Between Cutting Data Selection and Chip Form in Stainless Steel Turning, Machining Science and Technology 19 (2015) 217-235.

DOI: 10.1080/10910344.2015.1018530

Google Scholar

[9] E. Brinksmeier, J.C. Aurich, E. Govekar, C. Heinzel, H. -W. Hoffmeister, F. Klocke, J. Peters, R. Rentsch, D. J. Stephenson, E. Uhlmann, K. Weinert, M. Wittmann, Advances in modeling and simulation of grinding processes, CIRP Annals-Manufacturing Technology 55(2) (2006).

DOI: 10.1016/j.cirp.2006.10.003

Google Scholar

[10] R. Komanduri, M.L. Raff, A review on the molecular dynamics simulation of machining at the atomic scale, Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 215(12) (2001) 1639–1672.

DOI: 10.1177/095440540121501201

Google Scholar

[11] S. Goel, X. Luo, A. Agrawal, R.L. Reuben, Diamond machining of silicon: A review of advances in molecular dynamics simulation, International Journal of Machine Tools & Manufacture 88 (2015) 131–164.

DOI: 10.1016/j.ijmachtools.2014.09.013

Google Scholar

[12] R. Rentsch, I. lnasaki, Molecular dynamics simulation for abrasive processes, CIRP Annals-Manufacturing Technology 43(1) (1994) 327–330.

DOI: 10.1016/s0007-8506(07)62224-0

Google Scholar

[13] L. Zhang, H. Tanaka, Towards a deeper understanding of wear and friction on the atomic scale – A molecular dynamics analysis, Wear 211(1) (1997) 44–53.

DOI: 10.1016/s0043-1648(97)00073-2

Google Scholar

[14] R. Komanduri, N. Chandrasekaran, L.M. Raff, Some aspects of machining with negative-rake tools simulating grinding: A molecular dynamics simulation approach, Philosophical Magazine Part B 79(7) (1999) 955–968.

DOI: 10.1080/13642819908214852

Google Scholar

[15] B. Lin, S. Yu, S. Wang, An experimental study on molecular dynamics simulation in nanometer grinding, Journal of Materials Processing Technology 138(1–3) (2003) 484–488.

DOI: 10.1016/s0924-0136(03)00124-9

Google Scholar

[16] A.O. Oluwajobi, X. Chen, The fundamentals of modelling abrasive machining using molecular dynamics, International Journal of Abrasive Technology 3(4) (2010) 354–381.

DOI: 10.1504/ijat.2010.036967

Google Scholar

[17] J.C. Kim, R. Mayor, J. Ni, Molecular dynamics simulations of plastic material deformation in machining with a round cutting edge, International Journal of Precision Engineering and Manufacturing 13(8) (2011) 1303–1309.

DOI: 10.1007/s12541-012-0173-5

Google Scholar

[18] W. bin Rashid, S. Goel, X. Luo, J.M. Ritchie, The development of a surface defect machining method for hard turning processes, Wear 302 (1-2) (2013) 1124-1135.

Google Scholar

[19] J. Li, Q. Fang, Y. Liu, L. Zhang, A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding, Applied Surface Science 303 (2014) 331-343.

DOI: 10.1016/j.apsusc.2014.02.178

Google Scholar

[20] S.J. Eder, D. Bianchi, U. Cihak-Bayr, A. Vernes, G. Betz, An analysis method for atomistic abrasion simulations featuring rough surfaces and multiple abrasive particles, Computer Physics Communications 185(10) (2014) 2456–2466.

DOI: 10.1016/j.cpc.2014.05.018

Google Scholar

[21] J. Li, Q. Fang, L. Zhang, Y. Liu, The effect of rough surface on nanoscale high speed grinding by a molecular dynamics simulation, Computational Materials Science 98 (2015) 252-262.

DOI: 10.1016/j.commatsci.2014.10.069

Google Scholar

[22] S.J. Eder, U. Cihak-Bayr, A. Pauschitz, Nanotribological simulations of multi-grit polishing and grinding, Wear (In press).

DOI: 10.1016/j.wear.2015.03.006

Google Scholar

[23] A.P. Markopoulos, I.K. Savvopoulos, N.E. Karkalos, D.E. Manolakos, Molecular dynamics modeling of a single diamond abrasive grain in grinding, Frontiers of Mechanical Engineering (In press).

DOI: 10.1007/s11465-015-0337-y

Google Scholar