Preparation and Sintering Behavior of Au Conductor Pastes for LTCC Substrate

Yan Wang; Yang Liu; Ju Sheng Ma; Zhaowen Dong; Mingli Yin

doi:10.4028/www.scientific.net/MSF.475-479.1763

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HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Preparation and Sintering Behavior of Au Conductor...

Preparation and Sintering Behavior of Au Conductor Pastes for LTCC Substrate

Abstract:

Fine Au powders with spherical morphology and good dispersivity were produced. The average particle size is 1~2m. The influences of constituents on the rheology of organic vehicles were investigated by orthogonal design method. Consequently, the compatible Au thick film pastes for LTCC substrate have been prepared. SEM was carried out to study the sintering behaviors and microstructures of the buried pastes with LTCC substrate. These pastes have high electrical conductivity (less than 3m/sq.), reliable wire bond strength (greater than 9 grams, 25m Au wire) and fine line printability (as small as 80m). The via filling technology was also discussed in this paper.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

1763-1766

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.1763

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Online since:

January 2005

Authors:

Yan Wang, Yang Liu, Ju Sheng Ma, Zhaowen Dong, Mingli Yin

Keywords:

Conductor Paste, Electronic Packaging, LTCC Substrate, Sintering

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