[1]
S. Vepreck, S. Reiprich, A concept for the design of novel superhard coatings, Thin Solid Films 268 (1995) 64-71.
DOI: 10.1016/0040-6090(95)06695-0
Google Scholar
[2]
P. Goudeau, K. F. Badawi, A. Naudon, et al. Residual stress and microstructure of Cu/W multilayers, MRS Online Proceedings Library Archive, 308 (1993).
DOI: 10.1557/proc-308-713
Google Scholar
[3]
M. Rieth, Dudarev S L, De Vicente S M G, et al. Recent progress in research on tungsten materials for nuclear fusion applications in Europe, J. Nucl. Mater. 432 (2013) 482-500.
Google Scholar
[4]
V. Philipps, Tungsten as material for plasma-facing components in fusion devices, J. Nucl. Mater. 415 (2011) S2-S9.
DOI: 10.1016/j.jnucmat.2011.01.110
Google Scholar
[5]
R. Neu, R. Dux, A. Kallenbach, et al., Tungsten: an option for divertor and main chamber plasma facing components in future fusion devices, Nuclear Fusion 45 (2005) 209-218.
DOI: 10.1088/0029-5515/45/3/007
Google Scholar
[6]
Oliver B. M, Causey R. A, Maloy S. A, Deuterium retention and release from highly irradiated annealed tungsten after exposure to a deuterium DC glow discharge, J. Nucl. Mater. 329 (2004) 977.
DOI: 10.1016/j.jnucmat.2004.04.067
Google Scholar
[7]
Ou X, Anwand W, Kögler R, Zhou H and Richter A, The role of helium implantation induced vacancy defect on hardening of tungsten, J. Appl. Phys. 115 (2014) 123521.
DOI: 10.1063/1.4870234
Google Scholar
[8]
V. Kh. Alimov, W.M. Shu, J. Roth, et al., Temperature dependence of surface topography and deuterium retention in tungsten exposed to low-energy, high-flux D plasma, J. Nucl. Mater. 417 (2011) 572.
DOI: 10.1016/j.jnucmat.2011.01.088
Google Scholar
[9]
W.M. Shu, High-dome blisters formed by deuterium-induced local superplasticit, Appl. Phys. Lett. 92 (2008) 211904.
DOI: 10.1063/1.2937139
Google Scholar
[10]
W.M. Shu, E. Wakai, T. Yamanishi, Blister bursting and deuterium bursting release from tungsten exposed to high fluences of high flux and low energy deuterium plasma, Nuclear Fusion 47 (2007) 201.
DOI: 10.1088/0029-5515/47/3/006
Google Scholar
[11]
M.R. Gilbert, S.L. Dudarev, S. Zheng, et al., An integrated model for materials in a fusion power plant: transmutation, gas production, and helium embrittlement under neutron irradiation, Nuclear Fusion 52 (2012) 083019.
DOI: 10.1088/0029-5515/52/8/083019
Google Scholar
[12]
P.E. Lhuillier, P. Desgardin, et al., Helium retention and early stages of helium-vacancy complexes formation in low energy helium-implanted tungsten, J. Nucl. Mater. 433 (2013) 305-313.
DOI: 10.1016/j.jnucmat.2012.09.001
Google Scholar
[13]
P.E. Lhuillier, T. Belhabib, P. Desgardin, et al., Trapping and release of helium in tungsten, Journal of Nuclear Materials 416 (2011) 13-17.
DOI: 10.1016/j.jnucmat.2010.12.042
Google Scholar
[14]
M. Miyamoto, D. Nishijima, et al., Observations of suppressed retention and blistering for tungsten exposed to deuterium-helium mixture plasmas, Nuclear Fusion, 49 (2009) 065035.
DOI: 10.1088/0029-5515/49/6/065035
Google Scholar
[15]
T. Ogawa, A. Hasegawa, et al., Improvement of surface exfoliation behavior by helium-ion bombardment of a tungsten alloy fabricated by mechanical alloying, J. Nucl. Sci. Techn, 46(7) (2009) 717.
DOI: 10.1080/18811248.2007.9711578
Google Scholar
[16]
H. Kurishita, Kobayashi S, et al., Development of ultra-fine grained W-(0. 25-0. 8) wt% TiC and its superior resistance to neutron and 3MeV He-ion irradiations, J. Nucl. Mater. 377 (2008) 34.
DOI: 10.1016/j.jnucmat.2008.02.055
Google Scholar
[17]
M.A. Monge, M.A. Auger, et al., Characterization of novel W alloys produced by HIP, J. Nucl. Mater. 386-388 (2009) 613-617.
Google Scholar
[18]
L.J. Kecskes, K.C. Cho, Grain size engineering of bcc refractory metals: Top-down and bottom-up- Application to tungsten, Mater Sci. Eng. A, 467(1-2) (2007) 33-43.
DOI: 10.1016/j.msea.2007.02.099
Google Scholar
[19]
M. Kitada, Magnetic properties of immiscible Co-Ag and Ni-Ag thin films prepared by co-sputtering, J. Mater. Sci. 20(1) (1985) 269-273.
DOI: 10.1007/bf00555921
Google Scholar
[20]
M. Itoh, M. Hori, S. Nadahara, The origin of stress in sputter-deposited tungsten films for x-ray masks, J. Vac. Sci. Technol. B, 9 (1991) 149.
DOI: 10.1116/1.585277
Google Scholar
[21]
M.S. Aouadi, R.R. Parsons, P.C. Wong, et al., Characterization of sputter deposited tungsten films for x-ray multilayers, J. Vac. Sci. Tehnol. A, 10 (1992) 273.
Google Scholar
[22]
K.Y. Ahn, A comparison of tungsten film deposition techniques for very large scale integration technology, Thin Solid Films, 153 (1987) 469.
DOI: 10.1016/0040-6090(87)90206-9
Google Scholar
[23]
S.M. Rossnagel, I.C. Noyan, C. Cabral Jr., Phase transformation of thin sputter-deposited tungsten films at room temperature, J. Vac. Sci. Technol. B, 20 (2002) (2047).
DOI: 10.1116/1.1506905
Google Scholar
[24]
V.G. Glebovsky, VY. Yaschak, et al., Properties of titanium-tungsten thin films obtained by magnetron sputtering of composite cast targets, Thin Solid Films, 257(1) (1995) 1.
DOI: 10.1016/0040-6090(94)06326-5
Google Scholar
[25]
O. V. Ogorodnikova, T. Schwarz-Selinger, Deuterium retention in tungsten exposed to low-energy pure and helium-seeded deuterium plasmas, J. Appl. Phys. 109 (2011) 013309.
DOI: 10.1063/1.3505754
Google Scholar
[26]
K. L Westra, D. J. Thomson, The microstructure of thin films observed using atomic force microscopy, Thin Solid Films, 257 (1995) 15-21.
DOI: 10.1016/0040-6090(94)06351-6
Google Scholar
[27]
F.T.N. Vüllers, R. Spolenak, Alpha-vs. beta-W nanocrystalline thin films: A comprehensive study of sputter parameters and resulting materials' properties, Thin Solid Films, 577 (2015) 26-34.
DOI: 10.1016/j.tsf.2015.01.030
Google Scholar
[28]
L.B. Freund, S. Suresh, Thin Film Materials-Stress, Defect Formation and Surface Evolution.
Google Scholar
[29]
J.P. Singh, T. Karabacak, Nanoridge domains in α-phase W films, Surf. Sci. 538 (2003) 483-L487.
DOI: 10.1016/s0039-6028(03)00728-3
Google Scholar
[30]
J.A. Thornton, D.W. Hoffman, Stress-related effects in thin films, Thin Solid Films, 171 (1989) 5-31.
DOI: 10.1016/0040-6090(89)90030-8
Google Scholar
[31]
H. Windischmann, et. al, Intrinsic stress in sputter-deposited thin films, Crit. Rev. Solid State Mater. Sci. 17(6) (1992) 547-96.
DOI: 10.1080/10408439208244586
Google Scholar
[32]
J.A. Thornton, Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings, J. Vac. Sci. Technol. 12(4) (1975) 830-835.
DOI: 10.1116/1.568682
Google Scholar
[33]
D.W. Hoffman, J.A. Thornton. The compressive stress transition in Al, V, Zr, Nb and W metal films sputtered at low working pressures, Thin Solid Films, 45(2) (1977) 387-396.
DOI: 10.1016/0040-6090(77)90276-0
Google Scholar
[34]
W. Qingming, Y. Ding, Q. Chen, et al, Crystalline orientation dependence of nanomechanical properties of Pb (Zr 0. 52 Ti 0. 48) O3 thin films, Appl. Phys. Lett. 86 (2005) 162903.
DOI: 10.1063/1.1901805
Google Scholar
[35]
L. Maille, C. Sant, P. Garnier. A nanometer scale surface morphology study of W thin films, Mater. Sci. eng. C, 23 (2003) 913-918.
DOI: 10.1016/j.msec.2003.09.114
Google Scholar
[36]
G. Chen, D. Singh, O. Eryilmaz, et al., Depth-resolved residual strain in Mo N/Mo nanocrystalline films, Appl. Phys. Lett. 89(17) (2006) 172104-1.
DOI: 10.1063/1.2364131
Google Scholar
[37]
C.A. Chang, Formation of copper silicides from Cu (100)/Si (100) and Cu (111)/Si (111) structures, J. Appl. Phys. 67 (1990) 566-569.
DOI: 10.1063/1.345194
Google Scholar
[38]
H.M. Choi, S.K. Choi. Influence of residual stress and film thickness on crystallographic orientation in Al thin films deposited by bias sputtering, J. Vac. Sci. Technol. A, 16 (1998) 3348-3351.
DOI: 10.1116/1.581485
Google Scholar
[39]
Y. Wang, Z.X. Song, Crystalline orientation and surface structure anisotropy of annealed thin tungsten films, Surf. Coat. Technol. 201 (2007) 5518-5521.
DOI: 10.1016/j.surfcoat.2006.07.090
Google Scholar