On Specific Phase Transitions to the Compound-Like Impurity Nanosegregation Structures at Dislocations and Grain Boundaries in Metals and their Influence on Diffusion-Assisted Processes
p.91
p.91
Diffusion of Light Elements in BCC, FCC and HCP Metals
p.119
p.119
Analysis of Possibilities of Fisher’s Model Development
p.133
p.133
Structural Evolution of Al-Cr Alloy during Processing
p.145
p.145
Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders
p.153
p.153
On the Physicochemical Mechanism of the Influence of Preliminary Mechanical Activation on Self-Propagating High-Temperature Synthesis
p.159
p.159
Solid State Transformations in Cu/In-48Sn/Cu Diffusion Soldered Interconnections
p.165
p.165
Solid Phase’s Transformations in Boron Carbide Based Composites during Heat Treatment
p.175
p.175
Diffusional Growth Kinetics of Boride Layers on Iron-Chromium Alloys
p.181
p.181
Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders
Abstract:
The Ni3Sn4 intermetallic layer occurs at the interface of nickel and the saturated or undersaturated Sn-base solder melt at 250-450 °C and dipping times of 300 to 2400 s. Mathematical equations are proposed to evaluate the thickness of the Ni3Sn4 layer formed under conditions of simultaneous dissolution in the undersaturated solder melt.
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Periodical:
Solid State Phenomena (Volume 138)
Pages:
153-158
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Online since:
March 2008
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