Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte

M.N. Ervina Efzan; R. Kamaneeya

doi:10.4028/www.scientific.net/SSP.273.51

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Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution
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Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte
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HomeSolid State PhenomenaSolid State Phenomena Vol. 273Corrosion of Sn-Zn-Bi Lead Free Solder in KOH...

Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte

Abstract:

The corrosion of Sn-Zn-Bi lead free solder in 6M KOH electrolyte was conducted. The study was done using 3 different KOH concentrations (3M, 6M and 9M) and the immersion technique was used to produce corrosion. Due to the nature of immersion, the solder material was prepared by punching it into small billets size after melting it homogenously on a commercial hotplate. The immersion was set to 7, 14 and 21 days. After the specific days have fulfilled the sample billets were removed and tested. The corrosion of this solder was measured using various method such as graphical analysis, surface roughness, corrosion penetration rate (CPR) and optical microscope. In this research, it was found out that the sample billets taken from 6M concentration compared to 3M and 9M showed more corrosion this was supported by the outcome of the test. The 6M believed to provide best corrosion on the solder billets because of its high ionic conductivity value.

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Periodical:

Solid State Phenomena (Volume 273)

Pages:

51-55

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.273.51

Citation:

Cite this paper

Online since:

April 2018

Authors:

M.N. Ervina Efzan, R. Kamaneeya

Keywords:

Corrosion, Sn-Bi, Solder, Wettability

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