A main goal for solar cell research is to advance the metallisation to achieve higher efficiencies. Therefore the conductivity of the metal fingers and the contact between the wafer material and the metal has to be improved. For a lower contact resistivity between silver and silicon a nickel particle-free ink was synthesized and printed as seedlayer to show the influence of the promotion of building silver-silicon-structures by using nickel which is highly soluble in silicon and silver. This paper presents experiments of silver pastes containing a nickel complex and of a novel particle-free nickel ink, which is deposited as seedlayer. The nickel ink can be deposited using the above mentioned printing techniques for fine metal tracks or by spin coating to cover an area. The differences between using seedlayer techniques or contacting directly with a nickel containing paste is shown. The metal grits have been characterized by contact resistance on silicon wafers, by solar cell efficiency and adhesion tests.