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General Information
    • ISSN: 1793-8236 (Online)
    • Abbreviated Title Int. J. Eng. Technol.
    • Frequency:  Quarterly 
    • DOI: 10.7763/IJET
    • Managing Editor: Ms. Jennifer Zeng
    • Abstracting/ Indexing: Inspec (IET), CNKI Google Scholar, EBSCO, ProQuest, Crossref, Ulrich Periodicals Directory, Chemical Abstracts Services (CAS), etc.
    • E-mail: ijet_Editor@126.com
Editor-in-chief
IJET 2016 Vol.8(5): 380-384 ISSN: 1793-8236
DOI: 10.7763/IJET.2016.V8.917

Pain Level Measurement Using Discrete Wavelet Transform

Maryam Vatankhah and Amir Toliyat

Abstract—Experimental pain has extensively been used as a tool for investigating neural mechanisms and the psychological factors involved in pain processing. The detection of existence and/or level of pain is vital when verbal information is not present e.g. for infants, disabled persons, anesthetized patients and animals also. This study shows that there is a firm relation between Electroencephalogram (EEG) and chronic pain levels and EEG can be used as a reliable tool for detecting, measuring and diagnosing pain levels in humans. This paper proposed a use of wavelet coherency in order to estimate the three pain levels and its usage as an index for pain measurement. Besides, wavelet coefficients are studied to show consistencies with EEG dynamic were extracted to provide the feature vector. A Hidden Markov Model (HMM) and a support vector machine (SVM) scheme was used for pain levels classification. This study confirms the hypothesis that brain pattern under the chronic pain mental task is mapped on EEG and the dependency of brain patterns to EEG is possible and detectable.

Index Terms—Chronic pain index, electroencephalogram, SVM, HMM.

The authors are with the Computer Science Department, Stevens Institute of Technology, New Jersey, USA (e-mail: mvatankh@stevens.com, amir.toliyat.a@ieee.org).

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Cite: Maryam Vatankhah and Amir Toliyat, "Pain Level Measurement Using Discrete Wavelet Transform," International Journal of Engineering and Technology vol. 8, no. 5, pp. 380-384, 2016.

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