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Erschienen in: Journal of Materials Engineering and Performance 8/2018

29.06.2018

Low Solution Temperature Heat Treatment of AlSi9Cu3(Fe) High-Pressure Die-Casting Actual Automotive Components

verfasst von: Silvia Cecchel, Andrea Panvini, Giovanna Cornacchia

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 8/2018

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Abstract

Usually, high-pressure die-casting (HPDC) components cannot be heat-treated at high temperature without the occurrence of surface blisters, which are unacceptable for surface finish and may reduce the mechanical properties. In this context, the purpose of the present paper was to analyze the effectiveness of special low solution temperature T6 heat treatment in overcoming this limit for HPDC AlSi9Cu3 alloy. Very low solution temperatures (< 450 °C, followed by 165 °C aging) to prevent the occurrence of blisters were combined with commonly used times (from 1 to 16 h) ensuring the feasibility of industrial application. Treatments were conducted on samples extracted from actual castings to evaluate the typical defects encountered in common production. Properties were analyzed by means of visual inspection, microstructural observations, image analysis, hardness, tensile tests and fractography. The results showed that it is possible to use solubilization temperatures below 450 °C for several hours in a T6 treatment to give strengthening without relevant blistering in AlSi9Cu3 alloy. The optimum match of properties was provided by a solution treatment at 430 °C for 4 h followed by an aging at 165 °C for 8 h, which gave a yield increase of ~ 50 MPa, an increase in ductility and the best Quality Index value.

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Metadaten
Titel
Low Solution Temperature Heat Treatment of AlSi9Cu3(Fe) High-Pressure Die-Casting Actual Automotive Components
verfasst von
Silvia Cecchel
Andrea Panvini
Giovanna Cornacchia
Publikationsdatum
29.06.2018
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 8/2018
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-018-3478-4

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