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Erschienen in:
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies Kapitel lesen Erstes Kapitel lesen

2010 | OriginalPaper | Buchkapitel

8. Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications

verfasst von : Jerry Aguirre

Erschienen in: RF and Microwave Microelectronics Packaging

Verlag: Springer US

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Abstract

A critical component in mm-wave applications is the electromagnetic interconnect between devices. At mm-wave frequencies it is necessary to consider reducing the losses arising from that of using conventional transmission lines such as stripline and microstrip. An interconnect that offers comparatively lower loss connections at mm-wave frequencies is the laminate waveguide (LWG) constructed in low-temperature cofired ceramic (LTCC) technology. The LWG has superior loss characteristics as compared to stripline. The LWG, which propagates a dominant TE10 wave mode, approximates a dielectrically filled rectangular waveguide where the top and bottom walls are pattern printing and the sidewalls of the waveguide are tightly spaced via fences.

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Vorheriges Kapitel Ceramic Systems in Package for RF and Microwave
Nächstes Kapitel LTCC Substrates for RF/MW Application
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Metadaten
Titel
Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
verfasst von
Jerry Aguirre
Copyright-Jahr
2010
Verlag
Springer US
Buch
RF and Microwave Microelectronics Packaging

Print ISBN: 978-1-4419-0983-1

Electronic ISBN: 978-1-4419-0984-8

Copyright-Jahr: 2010

DOI
https://doi.org/10.1007/978-1-4419-0984-8_8

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