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Erschienen in: Measurement Techniques 3/2017

26.07.2017

Measurement of the Height of Nanorelief Elements by the Method of Three-Dimensional Reconstruction in a Scanning Electron Microscope

verfasst von: S. A. Darznek, D. A. Karabanov, A. Yu. Kuzin, V. B. Mityukhlyaev, P. A. Todua, M. N. Filippov

Erschienen in: Measurement Techniques | Ausgabe 3/2017

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Abstract

Comparative measurements of the height of the nanorelief steps of the surface of a silicon wafer by methods of three-dimensional reconstruction using a scanning electron microscope and profilometry were carried out. To realize the method of three-dimensional reconstruction, an islet gold film is formed on the surface of the test sample. The AlphaStep D-600 profiler is calibrated with a KTS-4500 QS step height gauge. The coincidence of the results of measurements with the methods of three-dimensional reconstruction and profilometry is established. The possibilities of reducing the uncertainty of the measurement results by the method of three-dimensional reconstruction were analyzed.

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Metadaten
Titel
Measurement of the Height of Nanorelief Elements by the Method of Three-Dimensional Reconstruction in a Scanning Electron Microscope
verfasst von
S. A. Darznek
D. A. Karabanov
A. Yu. Kuzin
V. B. Mityukhlyaev
P. A. Todua
M. N. Filippov
Publikationsdatum
26.07.2017
Verlag
Springer US
Erschienen in
Measurement Techniques / Ausgabe 3/2017
Print ISSN: 0543-1972
Elektronische ISSN: 1573-8906
DOI
https://doi.org/10.1007/s11018-017-1177-4

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