Mechanical Strength of Silicon Solar Wafers Characterized by Ring-On-Ring Test in Combination with Digital Image Correlation

Avoiding wafer breakage is a big challenge in the photovoltaic silicon industry, limiting production yield and further price reduction. Special fracture strength tests suitable for thin silicon solar wafers and solar cells, to be used in combination with Weibull statistics, finite-element (FE) modelling and digital image correlation have been developed in order to study the mechanical stability of solar wafers. The results show that removal of the saw damage significantly increases the strength of crystalline silicon wafers. Furthermore, it was found that silicon crystallinity and the location where the wafer is extracted from the cast Si ingot have a significant effect on the strength, namely samples taken from the bottom of the ingot are 30% stronger than those taken from the top. The study also showed that there is a decrease in fracture strength when an anti-reflective SiN_x coating is applied, which is caused by high thermal stresses.