Ausgabe 5/2003
Inhalt (17 Artikel)
The microstructure of an Fe-Mn-Si-Cr-Ni stainless steel shape memory alloy
Bikas C. Maji, Madangopal Krishnan, V. V. Rama Rao
Morphological stability of copper-silver multilayer thin films at elevated temperatures
H. Ludtke Knoedler, G. E. Lucas, C. G. Levi
Effects of tensile prestrain on the notch toughness of low-alloy steel
J. H. Chen, G. Z. Wang, Z. Li
High-temperature deformation behavior of coarse- and fine-grained MoSi2 with different silica contents
R. Mitra, N. Eswara Prasad, Sweety Kumari, A. Venugopal Rao
Role of microstructure on sulfide stress cracking of oil and gas pipeline steels
Ming-Chun Zhao, Bei Tang, Yi-Yin Shan, Ke Yang
The microstructure and fracture behavior of the dissimilar alloy 690-SUS 304L joint with various Nb addition
H. T. Lee, S. L. Jeng, T. Y. Kuo
Auger electron spectroscopy analysis at the ultrasonically welded interface between alumina and aluminum
Takehiko Watanabe, Atsushi Yanagisawa, Shiro Sunaga
Recrystallization and grain growth of cold-drawn gold bonding wire
J. -H. Cho, Y. W. Kim, K. H. Oh, J. -S. Cho, J. -T. Moon, J. Lee, Y. W. Cho, A. D. Rollett
Solidification of hastelloy alloys: an alternative interpretation
M. J. Perricone, J. N. DuPont, M. J. Cieslak
Salient shear bands and second-phase addition interactions of bulk metallic glass matrix composite
K. Q. Qiu, X. F. Wu, A. M. Wang, H. F. Zhang, B. Z. Ding, Z. Q. Hu
Influence of intense plastic straining on grain refinement, precipitation, and mechanical properties of Al-Cu-Li-Based alloys
H. G. Salem, R. E. Goforth, K. T. Hartwig
Effect of rolling temperature on the deformation and recrystallization textures of warm-rolled steels
Mohammad R. Toroghinejad, Fakhraddin Ashrafizadeh, Abbas Najafizadeh, Alan O. Humphreys, Dongsheng Liu, John J. Jonas
Grain refinement of Al-7Si alloys and the efficiency assessment by recognition of cooling curves
Q. Wang, Y. X. Li, X. C. Li
Deep filtration of molten aluminum using ceramic foam filters and ceramic particles with active coatings
M. Zhou, D. Shu, K. Li, W. Y. Zhang, H. J. Ni, B. D. Sun, J. Wang