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Journal of Materials Engineering and Performance

Erschienen in:

22.05.2020

Micro–Nano Dual-Scale Particle-Reinforced TiB₂/Cu-0.5Cr Composites Prepared by Vacuum Arc Melting

verfasst von: Jiang Feng, Shuhua Liang, Kexing Song, Xiuhua Guo, Yanjun Zhou

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 5/2020

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Abstract

In the present study, a TiB₂ particle-reinforced Cu/Cu-0.5Cr composite was prepared by vacuum arc melting (VAM). The microstructure, mechanical properties and electrical conductivity of the composite after heat treatment were studied. The results show that the micro–nano dual-scale particle-reinforced TiB₂/Cu-0.5Cr (VAM) composite possessed high strength, high hardness and high electrical conductivity. The nano-Cr particles were uniformly dispersed in the copper matrix, and the particle size was below 20 nm. The TiB₂ particles were also uniformly dispersed and had good bonding with the copper matrix. After peak aging at 475 °C for 4 h, the comprehensive properties of the TiB₂/Cu-0.5Cr (VAM) composite were improved. The hardness and electrical conductivity were 99.6 HBW and 82.3% IACS, respectively. The tensile test results show that the tensile strength of the TiB₂/Cu-0.5Cr (VAM) composite was 401 MPa, which is higher than that of the TiB₂/Cu (VAM) composite. The TiB₂/Cu-0.5Cr (VAM) composite had high strength and hardness due to the strengthening of the micro–nano dual-scale particles and the good interface bonding. Based on the tensile fracture morphology of the composite, the failure mechanism of the composite was determined and is discussed.

Vorheriger Artikel Selection of Process Parameters for Near-Net Shape Deposition in Wire Arc Additive Manufacturing by Genetic Algorithm

Nächster Artikel Isothermal Compression and Concomitant Dynamic Recrystallization Behavior of Ti-6.5Al-3.5Mo-1.5Zr-0.3Si Alloy with Initial Martensitic Microstructure

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Titel: Micro–Nano Dual-Scale Particle-Reinforced TiB2/Cu-0.5Cr Composites Prepared by Vacuum Arc Melting
verfasst von: Jiang Feng
Shuhua Liang
Kexing Song
Xiuhua Guo
Yanjun Zhou
Publikationsdatum: 22.05.2020
Verlag: Springer US
Erschienen in: Journal of Materials Engineering and Performance / Ausgabe 5/2020
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-020-04850-6

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