Microstructure effects in braze joints formed between Ag/W electrical contacts and Sn-coated Cu using Cu–Ag–P filler metal

Braze joints have been formed between Ag/W electrical contact tips and Sn-coated Cu straps using a Cu–Ag–P-based filler metal by short-cycle direct conductive heating from the Cu strap side. The microstructures of the braze joints have been investigated using a combination of scanning electron microscopy, energy-dispersive X-ray spectroscopy, electron backscatter diffraction, focused ion beam milling, and transmission electron microscopy. The braze joints exhibit regions with two distinct types of microstructures. Type I microstructures contain three micro-constituents: FCC (Ag), FCC (Cu), and a ternary eutectic [(Ag) + (Cu) + Cu₃P]. The difference between the proportions of these phases and those in the baseline filler metal can be accounted for on the basis of P loss due to self-fluxing during the brazing process. Type II microstructures contain mostly (Ag) and (Cu) with a small amount of Cu₃P but no ternary eutectic mixture. Other differences from the Type I regions include a lower P content, incomplete dispersion of the Sn layer, and a refined grain size in the majority (Cu) phase. These effects are accounted for on the basis of local differences in interfacial pressure due to the geometry of the Ag/W contact surface.