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Journal of Materials Engineering and Performance

Erschienen in:

01.09.2013

Microstructure Simulation of Al-Cu Alloy Based on Inverse Identified Interfacial Heat Transfer Coefficient

verfasst von: X. B. Bu, L. X. Li, L. Q. Zhang, B. W. Zhu, R. Xu, S. P. Wang

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 9/2013

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Abstract

The interfacial heat transfer coefficient (IHTC) is taken as one of the most important factors affecting the accuracy of the simulation. In the present paper, the IHTC variation with temperature was obtained by an inverse heat conduction method. Then, a 3D cellular automaton-finite element method was adopted to predict the microstructure of an Al-Cu alloy based on the identified IHTC. It was found that the IHTC was of prime importance for the precise simulation of solidification microstructure, especially in the grains distribution. In addition, the simulated results using the IHTC variation with temperature were found to exhibit a better agreement with the experimental results than those using the constant value.

Vorheriger Artikel Numerical Analysis of Effect of Backplate Diffusivity on the Transient Temperature in Friction Stir Welding

Nächster Artikel Hot Compression Deformation Behavior and Processing Maps of Mg-Gd-Y-Zr Alloy

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Titel: Microstructure Simulation of Al-Cu Alloy Based on Inverse Identified Interfacial Heat Transfer Coefficient
verfasst von: X. B. Bu
L. X. Li
L. Q. Zhang
B. W. Zhu
R. Xu
S. P. Wang
Publikationsdatum: 01.09.2013
Verlag: Springer US
Erschienen in: Journal of Materials Engineering and Performance / Ausgabe 9/2013
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-013-0543-x

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