01.09.2013 | Ausgabe 9/2013
Microstructure Simulation of Al-Cu Alloy Based on Inverse Identified Interfacial Heat Transfer Coefficient
- Zeitschrift:
- Journal of Materials Engineering and Performance > Ausgabe 9/2013
Abstract
The interfacial heat transfer coefficient (IHTC) is taken as one of the most important factors affecting the accuracy of the simulation. In the present paper, the IHTC variation with temperature was obtained by an inverse heat conduction method. Then, a 3D cellular automaton-finite element method was adopted to predict the microstructure of an Al-Cu alloy based on the identified IHTC. It was found that the IHTC was of prime importance for the precise simulation of solidification microstructure, especially in the grains distribution. In addition, the simulated results using the IHTC variation with temperature were found to exhibit a better agreement with the experimental results than those using the constant value.
