Ausgabe 1/2009 Special Issue on MicroNanoReliability 2007
Inhalt (27 Artikel)
Failure modeling of ACA-glued flip-chip on flex assemblies
- Technical Paper
B. Wunderle, C. Kallmayer, H. Walter, T. Braun, A. Gollhardt, B. Michel, H. Reichl
A simple method for testing the electromigration resistance of solders
- Technical Paper
M. Saka, T. Kohara, T. Hasegawa, M. Yamashita
Strength of hierarchical materials
- Technical Paper
Alberto Carpinteri, Pietro Cornetti, Nicola Pugno, Alberto Sapora
Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramics
- Technical Paper
Shouwen Yu, Li Yu
Design limitations related to conductive anodic filament formation in a micro-world
- Technical Paper
Antonio Caputo, Laura J. Turbini, Doug D. Perovic
How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments
- Technical Paper
W. H. Müller, H. Worrack, J. Sterthaus, J. Villain, J. Wilden, A. Juritza
Interlayer cooling potential in vertically integrated packages
- Technical Paper
T. Brunschwiler, B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl
Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections
- Technical Paper
M. Dreßler, K-F. Becker, B. Wunderle, J. Auersperg, H. Reichl
Study on fault diagnostic strategy of intelligent magnetic detection microsystems
- Technical Paper
Yongqiang Wang, Wenzhong Lou, Ningjun Fan, Jianwei Hao, Dayin Zhang
Distributed BIT diagnostic network Microsystems for miniature mobile robot
- Technical Paper
Yu Xiuli, Lou Wenzhong, Liu Xiaosong, Ma Baozheng, Wang Yongqiang
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
- Open Access
- Technical Paper
Zhiheng Huang, Paul P. Conway, Rongshan Qin
Exploring the applicability of gradient elasticity to certain micro/nano reliability problems
- Technical Paper
Elias C. Aifantis
Nonsingular dislocation and crack fields: implications to small volumes
- Technical Paper
J. Kioseoglou, I. Konstantopoulos, G. Ribarik, G. P. Dimitrakopulos, E. C. Aifantis
Failure of electronic devices due to condensation
- Technical Paper
C. Schimpf, K. Feldmann, C. Matzner, A. Steinke
Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards
- Technical Paper
J. Lee, C. S. Cho, J. E. Morris
Focused ion beam core hole drilling for stress detection in thin-films
- Technical Paper
H. Gerdes, H. H. Gatzen
Influence of material stiffness and geometrical variations on the electro-thermally driven microactuator performance
- Technical Paper
M. Shamshirsaz, M. Maroufi, M. B. Asgari, M. Gheisarieha
Assessment of testing methodologies for thin-film vacuum MEMS packages
- Open Access
- Technical Paper
Qian Li, Hans Goosen, Fred van Keulen, Joost van Beek, Guoqi Zhang
TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads
- Technical Paper
Tomasz Fałat, Kazimierz Friedel, Norman Marenco, Stephan Warnat
A silicon test chip for the thermomechanical analysis of MEMS packagings
- Technical Paper
Soeren Majcherek, Thomas Leneke, Soeren Hirsch
Changes in the microstructure of materials and their impact on reliability: experiments and modeling
- Technical Paper
Andreas Brandmair, Thomas Böhme, Wolfgang H. Müller
