Ausgabe 1/2012
Inhalt (15 Artikel)
Bi2Te3-Sb2Te3 on polymeric substrate for X-ray detectors based on the seebeck effect
- Technical Paper
J. G. Rocha, L. M. Goncalves, S. Lanceros-Mendez
Design, fabrication and testing of a high performance silicon piezoresistive Z-axis accelerometer with proof mass-edge-aligned-flexures
- Technical Paper
A. Ravi Sankar, J. Grace Jency, S. Das
A high Q micromachined single crystal silicon bulk mode resonator with pre-etched cavity
- Technical Paper
Guoqiang Wu, Dehui Xu, Bin Xiong, Yuelin Wang
Capacitive humidity sensors based on a newly designed interdigitated electrode structure
- Technical Paper
Ji-Hong Kim, Byung-Moo Moon, Sung-Min Hong
Hollow metallic microneedles fabricated by combining bulk silicon micromachining and UV–LIGA technology
- Technical Paper
Xiao-Xiao Yan, Jing-Quan Liu, Xiu-Cheng Shen, Chun-Sheng Yang
Experimental study of the flow-structure interactions in an air- or helium-filled hard disk drive geometry
- Technical Paper
S. W. Kil, J. A. C. Humphrey, H. Haj-Hariri
Numerical study of the flow-structure interactions in an air- or helium-filled simulated hard disk drive
- Technical Paper
Sae Woong Kil, Joseph A. C. Humphrey, Hossein Haj-Hariri
A lateral RF MEMS capacitive switch utilizing parylene as dielectric
- Technical Paper
Xunjun He, Bo Liu, Zhiqiu Lv, Zhihong Li
Numerical investigation on a laser based localised joining with a glass frit intermediate layer
- Technical Paper
Qiang Wu, Yuliya Semenova, Pengfei Wang, Gerald Farrell
Effects of electrophoresis and electroosmotic flow on ion enrichment in micro-nanofluidic preconcentrator
- Technical Paper
Jun-yao Wang, Zheng Xu, Chong Liu, Jun-shan Liu, Yun-liang Liu, Li-ding Wang, Wen-dong Yang
Laser micro-welding of aluminum and copper with and without tin foil alloy
- Technical Paper
Mohammad M. Hailat, Ahsan Mian, Zariff A. Chaudhury, Golam Newaz, Rahul Patwa, Hans J. Herfurth
Study of residual stress-induced deformation of multilayer cantilever for maskless microplasma etching
- Technical Paper
Li Wen, Zhen Yuan, Leili Cheng, Hongjiang Zeng, Jiaru Chu
Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP
- Technical Paper
Jiajie Tang, Xiaoyun Ding, Fei Geng, Xiaowei Sun, Le Luo
The design and micromachining of an electromagnetic MEMS flapping-wing micro air vehicle
- Technical Paper
Kun Meng, Weiping Zhang, Wenyuan Chen, Hongyi Li, Pengcheng Chi, Caijun Zou, Xiaosheng Wu, Feng Cui, Wu Liu, Jinge Chen
Device level studies of adaptive optics sliding components in microprojectors
- Technical Paper
James Hunt, Bharat Bhushan
