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Microsystem Technologies

Ausgabe 1/2015

Inhalt (39 Artikel)

RETRACTED ARTICLE: A MEMS packaged capacitive pressure sensor employing 3C-SiC with operating temperature of 500 °C

  • Review Paper

Noraini Marsi, Burhanuddin Yeop Majlis, Azrul Azlan Hamzah, Faisal Mohd-Yasin

Development research of thermocouple-based microwave power sensors using AC/DC substitution method

  • Technical Paper

De-bo Wang, Wen-juan Bai, Changchun Zhang, Yanyan Guo, Jing Chen

Improvement of measurement sensitivity near contact in intensity-interferometry flying height testers

  • Technical Paper

Korakoch Phetdee, Alongkorn Pimpin, Werayut Srituravanich

Hydrodynamic focusing micropump module with PDMS/nickel-particle composite diaphragms for microfluidic systems

  • Technical Paper

Jeonghwan Kim, Kyung-Nam Kang, Yoonyoung Jin, Jost Goettert, Pratul K. Ajmera

A new validation method for clinical grade micro-encapsulation: quantitative high speed video analysis of alginate capsule

  • Open Access
  • Technical Paper

Ina Meiser, Sabine C. Müller, Friederike Ehrhart, Stephen G. Shirley, Heiko Zimmermann

Design optimization of linearly DC controlled staggered vertical comb drive actuators

  • Technical Paper

Alaa Elhady, Diaa Khalil, M. A. E. Mahmoud

A new silicon biaxial decoupled resonant micro-accelerometer

  • Technical Paper

Bo Yang, Hui Zhao, Bo Dai, Xiaojun Liu

Graphene diaphragm analysis for pressure or acoustic sensor applications

  • Technical Paper

Dongxue Wang, Shangchun Fan, Wei Jin

A near zero skew actuation mechanism for hard disk drives

  • Technical Paper

Zhimin He, Jianqiang Mou, Kheong Sann Chan, Suet Hoi Lam, Wuzhong Lin

Implantable electrode array with platinum black coating for brain stimulation in fish

  • Technical Paper

Chuan Zhang, Jing-Quan Liu, Hong-Chang Tian, Xiao-Yang Kang, Jing-Cheng Du, Yue-Feng Rui, Bin Yang, Chun-Sheng Yang

Integration method of silicon sensors on SU-8-based microfluidic platforms

  • Technical Paper

Francisco Perdigones, Carmen Aracil, José M. Quero, Manuel Gutiérrez, Cecilia Jiménez, Pablo Giménez

Design and fabrication of a novel tri-axis gyroscope with sensing diagonal-pendulums

  • Technical Paper

M. C. Wang, J. W. Jiao, P. L. Yan, B. W. Mi, S. Qin, W. J. Liu

Electromagnetic modeling and parameter extraction of RF-MEMS switch

  • Technical Paper

Ashish Kumar Sharma, Navneet Gupta

High temperature characteristic for wireless pressure LTCC-based sensor

  • Technical Paper

Tan Qiulin, Kang Hao, Qin Li, Xiong Jijun, Liu Jun, Xue Chenyang, Zhang Wendong, Luo Tao

Suspended high Q integrated inductor by wafer level packaging technology

  • Technical Paper

M. Han, S. F. Wang, G. W. Xu, Le Luo

A high sensitive and robust controllable MEMS gyroscope with inherently linear control force using a high performance 2-DOF oscillator

  • Technical Paper

Zahra Deyhim, Zeinab Yousefi, Habib Badri Ghavifekr, Esmaeil Najafi Aghdam

Design and simulation of bidirectional impact sensors array with optimized air damped response

  • Technical Paper

Saeid Hematian Dehkordi, Reza Askari Moghadam, Javad Koohsorkhi

Field effect transistor with integrated microfluidic channel as pH sensor

  • Technical Paper

I. Bouhadda, O. De Sagazan, F. Le Bihan

Application of vertically aligned carbon nanotubes on burnishing slider in cleaning process of magnetic disk surfaces

  • Technical Paper

Hiroshi Tani, Keisuke Konishi, Wataru Norimatsu, Michiko Kusunoki, Norio Tagawa

Temperature dependence of the electromechanical characteristics of superconducting RF-MEMS switches

  • Technical Paper

N. Alcheikh, P. Xavier, J. M. Duchamp, K. F. Schuster, C. Malhaire, B. Remaki, C. Boucher, X. Mescot

Modeling and simulation of metal organic halide vapor phase epitaxy (MOHVPE) growth chamber

  • Technical Paper

N. Zieyana Mohamed Annuar, Mohd Faizul Mohd Sabri, A. Shuhaimi Abu Bakar

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG