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Microsystem Technologies

Ausgabe 1/2017

Inhalt (25 Artikel)

Analytical analysis and experimental investigation of energy loss mechanisms in rocking mass microgyroscope

  • Technical Paper

Xiong Wang, Xiaobin Xu, Tao Zhu, Xuezhong Wu, Mengchun Pan

Fabrication and characterization of hydrothermally grown MgZnO nanorod films for Schottky diode applications

  • Technical Paper

Shaivalini Singh, G. R. Dillip, Sumit Vyas, Md. Roqibul Hasan, Il-Kyu Park, P. Chakrabarti, Si-Hyun Park

Analytical modeling of a silicon-polymer electrothermal microactuator

  • Technical Paper

Huu Phu Phan, Minh Ngoc Nguyen, Ngoc Viet Nguyen, Duc Trinh Chu

Novel shock wave excitation method for dynamic characterization of microstructures

  • Technical Paper

Dongsheng She, Yiliu Yang, Zefei Wei, Kun Li, Zhen Yu, Feng Ding

Electric field and induced charges distribution model for MEMS strip-type sensing electrodes

  • Technical Paper

Yigeng Fang, Chunrong Peng, Pengfei Yang, Dongming Fang, Shanhong Xia

Research on the non-ideal dynamics of a dual-mass silicon micro-gyroscope

  • Technical Paper

Bo Yang, Xingjun Wang, Di Hu, Lei Wu

Development of implantable catheter flow sensor into inside of bronchi for laboratory animal

  • Technical Paper

Mitsuhiro Shikida, Takuya Matsuyama, Takayuki Yamada, Miyoko Matsushima, Tsutomu Kawabe

Resilient controller design availing recursive technique rooted Lyapunov function for a dynamic system

  • Technical Paper

V. Aneesh, Rahul Antony, M. S. Giri Nandagopal, Ganesh Paramasivan, N. Selvaraju

Portable signal conditioning system of a MEMS magnetic field sensor for industrial applications

  • Technical Paper

M. Lara-Castro, A. L. Herrera-May, R. Juarez-Aguirre, F. López-Huerta, C. A. Ceron-Alvarez, I. E. Cortes-Mestizo, E. A. Morales-Gonzalez, H. Vazquez-Leal, S. M. Dominguez-Nicolas

Fabrication of bonded SiC structure with cavity based on direct bonding process for MEMS device applications

  • Technical Paper

Ting Liang, Xinxin Wang, Pinggang Jia, Wendong Zhang, Chenyang Xue, Jijun Xiong

A new electrostatically actuated rotary three-state DC-contact RF MEMS switch for antenna switch applications

  • Technical Paper

Afshin Kashani Ilkhechi, Hadi Mirzajani, Esmaeil Najafi Aghdam, Habib Badri Ghavifekr

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG