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Microsystem Technologies

Ausgabe 10/2015

Inhalt (26 Artikel)

Research development of silicon MEMS gyroscopes: a review

  • Review Paper

Guo Zhanshe, Cheng Fucheng, Li Boyu, Cao Le, Lu Chao, Song Ke

Rectangular slotted microstrip line fed compact printed antenna with etched ground plane for UWB communications

  • Technical Paper

S. Srinivasa Kumar, G. Sasibhushana Rao, Ramu Pillalamarri

Design aspect of high power handling applications: metal contact switches

  • Technical Paper

Prachi Jhanwar, Deepak Bansal, Shilpi Pandey, Seema Verma, K. J. Rangra

Computation of capacitance and electrostatic forces for the electrostatically driving actuators considering fringe effects

  • Technical Paper

Dongming Fang, Fengjie Zheng, Bo Chen, Yu Wang, Yigeng Fang, Pengfei Yang, Xiaolong Wen, Chunrong Peng, Shanhong Xia

Reconfigurable metamaterial components exploiting two-hot-arm electrothermal actuators

  • Technical Paper

Antonios X. Lalas, Nikolaos V. Kantartzis, Theodoros D. Tsiboukis

Research on hot embossing process of high fill factor microlens array

  • Technical Paper

Yiqing Wang, Qing Zhang, Xinbin Kuang, Yucheng Ding, Feng Chen, Hongzhong Liu

A low-power, micromachined, double spiral hotplate for MEMS gas sensors

  • Technical Paper

Mahanth Prasad, Vinod Kumar Khanna

Vibratory ring six-axis motion sensor

  • Technical Paper

Ahmed M. Abdul-wahed, Mohamed A. E. Mahmoud

Study on a vibratory tri-axis MEMS gyroscope with single drive and multiple axes angular rate sense

  • Technical Paper

Zhang Tingkai, Xing Chaoyang, Zhang Ling, Wang Wei

A novel facile synthesis and electromagnetic wave shielding effectiveness at microwave frequency of graphene oxide paper

  • Technical Paper

Nadia Abdel Aal, Faten Al-Hazmi, Ahmed A. Al-Ghamdi, Attieh A. Al-Ghamdi, Farid El-Tantawy, F. Yakuphanoglu

Analysis of rectangular and triangular end array type piezoelectric vibration energy harvester

  • Technical Paper

S. Kirubaveni, S. Radha, B. S. Sreeja, T. Sivanesan

New design architecture of a 3-DOF vibratory gyroscope with robust drive operation mode and implementation

  • Technical Paper

Payal Verma, Chandra Shekhar, Sandeep K. Arya, Ram Gopal

Atomistic simulation of electrical enhanced nanowelding of carbon nanotube to metal

  • Technical Paper

Xiaohui Song, Jibin Liu, Hui Li, Lanpu Zhao

Dynamic characterization of bulk micromachined accelerometer using laser doppler vibrometer (LDV)

  • Technical Paper

A. Sharma, R. Mukhiya, S. Santosh Kumar, R. Gopal, B. D. Pant

Design, modeling and FEM-based simulations of a 1-DoF MEMS bulk micromachined piezoresistive accelerometer

  • Technical Paper

R. Mukhiya, R. Gopal, B. D. Pant, V. K. Khanna, T. K. Bhattacharyya

Low cost packaging for gas sensors

  • Technical Paper

Rahul Prajesh, Nishit Jain, Ajay Agarwal

Electrical contact performance of MEMS acceleration switch fabricated by UV-LIGA technology

  • Technical Paper

Zhijian Zhou, Weirong Nie, Zhanwen Xi, Xiaofeng Wang

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG