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Microsystem Technologies

Ausgabe 10/2022 Special Issue on ISPS 2021

Inhalt (21 Artikel)

Foreword- ASME ISPS 2021

  • Editorial

Bharat Bhushan

Shear test evaluation of the mechanical reliability of micro bumps in semiconductors

  • Technical Paper

Yeungjung Cho, Mibbeum Hahn, Hyunsik Jeong, Gunhee Jang

Backstepping control of novel arc-shaped SMA actuator

  • Technical Paper

Abdul Manan Khan, Buhyun Shin, Muhammad Usman, Youngshik Kim

Prediction of OLED temperature distribution based on a neural network model

  • Technical Paper

S. F. Lin, Duc Huy Nguyen, Paul C.-P. Chao, Hao Ren Chen

High-performance infrared image processing with gray-scale dynamic range correction implemented by FPGA

  • Technical Paper

Chung-Kai Tasu, Duc Huy Nguyen, Bhaskar Choubey, Paul C.-P. Chao

Miniaturized double-legged robot utilizing perpendicular-axes electromagnetic actuator

  • Technical Paper

Quang Hoan Le, Wanghun Lee, Youngshik Kim, Buhyun Shin

Design and implementation of a new torque controller via FPGA for 6-DOF articulated robots

  • Technical Paper

Tan-Phat Phan, Paul C.-P. Chao, Zih-Wei Huang

Development of a vertical linear actuator with gravity compensation for long stroke

  • Technical Paper

Buhyun Shin, Taerim Ham, Daeyeong Gwak, Kyung-min Lee

Modeling and control of two DOF shape memory alloy actuators with applications

  • Original Research

Hussein F. M. Ali, Youngshik Kim, Quang Hoan Le, Buhyun Shin

Technology scaling impact on VLSI interconnect and low swing signaling technique

  • Technical Paper

Rajeev Kumar Pandey, Eka Fitrah Pribadi, Paul C.-P. Chao

Passive air leakage detection mechanism for enhanced vacuum suction actuator efficiency

  • Technical Paper

Seung Ho Lee, Dong Jun Oh, Sang Hoon Ji, Ja Choon Koo

A high-speed, short-stroke xy-stage with counterbalance mechanisms for highly focused laser machining

  • Technical Paper

Joanne Yoon, Raehun Jung, Sung-Joon Ye, Young-bong Bang

Force feedback haptic interface for bilateral teleoperation of robot manipulation

  • Technical Paper

Jae Hwan Bong, Sunwoong Choi, Jin Hong, Shinsuk Park

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Bildnachweise
    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG