Ausgabe 11-12/2007 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Stresa - Italy, 26-28 April 2006
Inhalt (33 Artikel)
A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200 °C
- Technical Paper
R. Hellín Rico, J.-P. Celis, K. Baert, C. Van Hoof, A. Witvrouw
A novel packaging approach for RF MEMS switching functions on alumina substrate
- Technical Paper
Mohamad El Khatib, Arnaud Pothier, Aurelian Crunteanu, Pierre Blondy
Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications
- Technical Paper
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung
Ultra fine pitch flat panel display packaging using 3 μm conductive particles
- Technical Paper
G. J. Wang, Y. C. Lin, G. S. Lin
A novel contact resistance model of anisotropic conductive film for FPD packaging
- Technical Paper
G. J. Wang, Y. C. Lin, G. S. Lin
High quality factor copper inductors integrated in deep dry-etched quartz substrates
- Technical Paper
C. Leroy, M. B. Pisani, C. Hibert, D. Bouvet, M. Puech, A. M. Ionescu
Fabrication of silicon-on-insulator MEM resonators with deep sub-micron transduction gaps
- Technical Paper
Nicoleta Diana Badila Ciressan, Cyrille Hibert, Marco Mazza, Adrian M. Ionescu
Design of bossed silicon membranes for high sensitivity microphone applications
- Technical Paper
P. Martins, S. Beclin, S. Brida, S. Metivet, O. Stojanovic, C. Malhaire
Studies on a micro turbine device with both journal- and thrust-air bearings
- Technical Paper
X. C. Shan, Q. D. Zhang, Y. F. Sun, R. Maeda
Development of a multi-layer microelectrofluidic platform
- Technical Paper
S. H. Ng, Z. F. Wang, R. T. Tjeung, N. F. de Rooij
Quality factor of micro cantilevers transduced by piezoelectric lead zirconate titanate film
- Technical Paper
Jian Lu, Tsuyoshi Ikehara, Takeshi Kobayashi, Ryutaro Maeda, Takashi Mihara
The design and fabrication of polymerase chain reaction platform
- Technical Paper
Chao-Heng Chien, Hui-Min Yu
Design and fabrication of the concentric circle light guiding plate for LED-backlight module by MEMS technique
- Technical Paper
Chao-Heng Chien, Zhi-Peng Chen
Concave microlens array mold fabrication in photoresist using UV proximity printing
- Technical Paper
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao
Yield analysis via induction of process statistics into the design of MEMS and other microsystems
- Technical Paper
Shyam Praveen Vudathu, Kishore Kumar Duganapalli, Rainer Laur, Dorota Kubalińska, Angelika Bunse-Gerstner
High current densities in copper microcoils: influence of substrate on failure mode
- Technical Paper
Johan Moulin, Marion Woytasik, Jean-Paul Grandchamp, Elisabeth Dufour-Gergam, Alain Bosseboeuf
Design and development of sub-micron scale specimens with electroplated structures for the microtensile testing of thin films
- Technical Paper
Ming-Tzer Lin, Chi-Jia Tong, Chung-Hsun Chiang
Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package
- Technical Paper
Ja-Myeong Koo, Seung-Boo Jung
Characterization of flexible RF microcoils dedicated to local MRI
- Technical Paper
M. Woytasik, J.-C. Ginefri, J.-S. Raynaud, M. Poirier-Quinot, E. Dufour-Gergam, J.-P. Grandchamp, O. Girard, P. Robert, J.-P. Gilles, E. Martincic, L. Darrasse
High viscous liquids as a source in micro-screw heat exchanger: fabrication, simulation and experiments
- Technical Paper
Haifa El-Sadi, Nabil Esmail, Andreas K. Athienitis
MEMS tunable capacitors with fragmented electrodes and rotational electro-thermal drive
- Technical Paper
A. Mehdaoui, M. B. Pisani, D. Tsamados, F. Casset, P. Ancey, A. M. Ionescu
Micro-ball lens array fabrication in photoresist using PTFE hydrophobic effect
- Technical Paper
Ruey Fang Shyu, Hsiharng Yang, Wen-Ren Tsai, Jhy-Cherng Tsai
Integration of micro-electro-mechanical deformable mirrors in doped fiber amplifiers
- Technical Paper
D. Bouyge, A. Crunteanu, D. Sabourdy, P. Blondy, V. Couderc, J. Lhermite, L. Grossard, A. Barthélemy
Design and modeling of electromagnetic actuator in mems-based valveless impedance pump
- Technical Paper
Hsien-Tsung Chang, Chia-Yen Lee, Chih-Yung Wen
Miniaturized fluorescence excitation platform with optical fiber for bio-detection chips
- Technical Paper
Hsiharng Yang, Chung-Tze Lee, Fuh-Yu Chang
Power processing circuits for electromagnetic, electrostatic and piezoelectric inertial energy scavengers
- Technical Paper
P. D. Mitcheson, T. C. Green, E. M. Yeatman
Scaling effects for electromagnetic vibrational power generators
- Technical Paper
Terence O’Donnell, Chitta Saha, Steve Beeby, John Tudor
Experimental comparison of macro and micro scale electromagnetic vibration powered generators
- Technical Paper
S. P. Beeby, M. J. Tudor, R. N. Torah, S. Roberts, T. O’Donnell, S. Roy
Vibrational energy scavenging with Si technology electromagnetic inertial microgenerators
- Technical Paper
Christophe Serre, Alejandro Pérez-Rodríguez, Nuria Fondevilla, Joan Ramon Morante, Josep Montserrat, Jaume Esteve
MEMS design and fabrication of an electrostatic vibration-to-electricity energy converter
- Technical Paper
Yi Chiu, Chiung-Ting Kuo, Yu-Shan Chu
Recent developments in MEMS-based miniature fuel cells
- Technical Paper
Tristan Pichonat, Bernard Gauthier-Manuel
