Ausgabe 11/2010
Inhalt (21 Artikel)
MEMS switches controlled multi-split ring resonator as a tunable metamaterial component
- Technical Paper
Xun-jun He, Yue Wang, Jian-min Wang, Tai-long Gui
A directly strain measuring method for electroplated nickel micro-tensile test
- Technical Paper
Jun Tang, Hong Wang, Rui Liu, Xueping Li, Zhenjie Zhang, Jinyuan Yao, Guifu Ding
Fabrication of steel roller imprinting molds through adapting conventional planar micro fabrication tools
- Technical Paper
Meng-Chi Huang, Chien-Chung Fu
A mechanism influencing micro injection molded weld lines of hybrid nano filled polypropylene
- Technical Paper
Lei Xie, Stefan Kirchberg, Leif Steuernagel, Gerhard Ziegmann
Miniaturization limits of field-effect based MEMS accelerometers
- Technical Paper
Manuel Engesser, Oleg Jakovlev, Axel R. Franke, Jan G. Korvink
Modeling, microfabrication and experiments of a free–free cantilever bistable micro mechanism supported with a diamond configuration
- Technical Paper
Yi-Bo Wu, Juang Wang, Chun-Ping Yan, Sheng-Ping Mao, Cong-Chun Zhang, Hong Wang, Gui-Fu Ding
Measurement of mechanical and thermal properties of co-sputtered WSi thin film for MEMS applications
- Technical Paper
Bui Thanh Tung, Dzung Viet Dao, Toshiyuki Toriyama, Susumu Sugiyama
Photolamination bonding for PMMA microfluidic chips
- Technical Paper
Yun-Chuan Xie, Yan Xu, Kai-Leung Yung, Long-Biao Huang, Ming-Hong Lee
Biodegradable submicrometric sieves in PLLA fabricated by soft lithography
- Technical Paper
Luis Gutierrez-Rivera, Lucila Cescato
Characterization of an electro-thermal micro gripper and tip sharpening using FIB technique
- Technical Paper
A. Deutschinger, U. Schmid, M. Schneider, W. Brenner, H. Wanzenböck, B. Volland, Tzv. Ivanov, I. W. Rangelow
Nonlinear buckling analysis of vertical wafer probe technology
- Technical Paper
Torsten Hauck, Wolfgang H. Müller, Ilko Schmadlak
Geometric optimization of van der Pauw structure based MEMS pressure sensor
- Technical Paper
Ahsan Mian, Jesse Law
Effects of cross-sectional change on the isotachphoresis process for protein-separation chip design
- Technical Paper
Hongsoo Choi, Youngwon Jeon, Migyung Cho, Dong-yeon Lee, Jaesool Shim
Geometrical analysis of planar coil design for fluxgate magnetometer
- Technical Paper
J. Yunas, N. Sulaiman, G. Sugandi, A. A. Hamzah, B. Y. Majlis
Verification of the interrelation between local wall thinning and velocity components observed in the deflected turbulent flow inside orifice of carbon steel piping
- Technical Paper
Kyung Hoon Kim, Sang Hoon Park, Kyeong Mo Hwang
Micropatterning of sulfonated polyaniline using a soft lithography based lift-off process
- Technical Paper
Nicholas Ferrell, Yanyin Yang, Derek J. Hansford
Design, implementation and testing of electrostatic SOI MUMPs based microgripper
- Technical Paper
Fahimullah Khan, Shafaat A. Bazaz, Muhammad Sohail
Thermal stresses on membrane based microdevices
- Technical Paper
Onursal Onen, Lynford Davis, Christopher Nelson, Rasim O. Guldiken
1-3 Piezocomposites realised from small feature size, high aspect ratio, hot embossed moulds. Part I. Mould development
- Technical Paper
T. J. Clipsham, T. W. Button
1-3 Piezocomposites realised from small feature size, high aspect ratio, hot embossed moulds. Part II: piezocomposite fabrication
- Technical Paper
T. J. Clipsham, T. W. Button
Effects of material improvement and injection moulding tool design on the movability of sintered two-component micro parts
- Technical Paper
Andreas Ruh, Volker Piotter, Klaus Plewa, Hans-Joachim Ritzhaupt-Kleissl, Jürgen Haußelt
