Ausgabe 11/2012 Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2011
Inhalt (23 Artikel)
Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
- Editorial
Bernard Courtois, Bernd Michel
Fabrication of aluminium doped zinc oxide piezoelectric thin film on a silicon substrate for piezoelectric MEMS energy harvesters
- Technical Paper
Aliza Aini Md Ralib, Anis Nurashikin Nordin, Hanim Salleh, Raihan Othman
An electromechanical model for a clamped–clamped beam type piezoelectric transformer
- Technical Paper
Chia-Che Wu, Chi-Shao Chen
Dynamic behavior of resonant piezoelectric cantilever as liquid level detection sensor
- Technical Paper
M. Maroufi, M. Shamshirsaz
Microstructured silicon membrane with soft suspension beams for a high performance MEMS microspeaker
- Technical Paper
Iman Shahosseini, Elie Lefeuvre, Emile Martincic, Marion Woytasik, Johan Moulin, Souhil Megherbi, Romain Ravaud, Guy Lemarquand
Multiple-output MEMS DC/DC converter: a system modeling study
- Technical Paper
A. Chaehoi, M. Begbie, D. Weiland, Z. J. Chew, L. Li
Study of black silicon obtained by cryogenic plasma etching: approach to achieve the hot spot of a thermoelectric energy harvester
- Technical Paper
K. N. Nguyen, D. Abi-Saab, P. Basset, E. Richalot, M. Malak, N. Pavy, F. Flourens, F. Marty, D. Angelescu, Y. Leprince-Wang, T. Bourouina
Fabrication and characterization of a fused silica-based optical waveguide with femtosecond fiber laser pulses
- Technical Paper
Jaw-Luen Tang, Chien-Hsing Chen, Ting-Chou Chang, Shau-Chun Wang, Lai-Kwan Chau, Wei-Te Wu
Interfacial configurations and mixing performances of fluids in staggered curved-channel micromixers
- Technical Paper
Jyh Jian Chen, Yi Shiang Shie
Fabrication methods for the manufacture of sapphire microparts
- Technical Paper
David M. Allen, Roxana Redondo, Maximilien Dany
Study of crescent shaped alignment marks applicable to self-alignment of micro-parts with and without positive and negative poles
- Technical Paper
Dong F. Wang, Shouhei Shiga, Takao Ishida, Ryutaro Maeda
Fabrication of a high aspect ratio nanoporous array on silicon
- Technical Paper
Jing-Yu Ho, Kang J. Chang, Gou-Jen Wang
Hot embossing of thermoplastic multilayered stacks
- Technical Paper
A. Kolew, M. Heilig, M. Schneider, K. Sikora, D. Münch, M. Worgull
SU-8-based rapid tooling for thermal roll embossing
- Technical Paper
Khaled Metwally, Laurent Robert, Roland Salut, Chantal Khan-Malek
Polymer-based fabrication techniques for enclosed microchannels in biomedical applications
- Technical Paper
Annabel Krebs, Thorsten Knoll, Dominic Nußbaum, Thomas Velten
Particle focusing in a contactless dielectrophoretic microfluidic chip with insulating structures
- Technical Paper
Chun-Ping Jen, Nikolay A. Maslov, Hsin-Yuan Shih, Yung-Chun Lee, Fei-Bin Hsiao
A microfabricated module for isolating cervical carcinoma cells from peripheral blood utilizing dielectrophoresis in stepping electric fields
- Technical Paper
Chun-Ping Jen, Ho-Hsien Chang, Ching-Te Huang, Kuang-Hung Chen
Passive piezoelectric DC sensor applicable to one-wire or two-wire DC electric appliances for end-use monitoring of DC power supply
- Technical Paper
Dong F. Wang, Kohei Isagawa, Takeshi Kobayashi, Toshihiro Itoh, Ryutaro Maeda
Novel full range vacuum pressure sensing technique using free decay of trapezoid micro-cantilever beam deflected by electrostatic force
- Technical Paper
Yu-Ting Wang, Tien-Chen Hu, Chi-Jia Tong, Ming-Tzer Lin
Linear energy control of laser drilling and its application in the repair of TFT-LCD bright pixels
- Technical Paper
Taco Chen, Ming-Tzer Lin, Kuan-Jung Chung
Measurement of electrical properties of materials under the oxide layer by microwave-AFM probe
- Technical Paper
Lan Zhang, Yang Ju, Atsushi Hosoi, Akifumi Fujimoto
Mode localization analysis and characterization in a 5-beam array of coupled nearly identical micromechanical resonators for ultra-sensitive mass detection and analyte identification
- Technical Paper
Dong F. Wang, Keisuke Chatani, Tsuyoshi Ikehara, Ryutaro Maeda
The influence of adhesive materials on chip-on-board packing of MEMS microphone
- Technical Paper
Cheng-Hsin Chuang, Yi-Hsuan Huang, Shin-Li Lee
