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Microsystem Technologies

Ausgabe 11/2021 Special Issue On More Than Moore Microsystems

Inhalt (20 Artikel)

Preface

  • Editorial

Jyotsna Kumar Mandal, Angsuman Sarkar

Characterization and analysis of low-noise GaN-HEMT based inverter circuits

  • Technical Paper

Sritoma Paul, Shubham Mondal, Angsuman Sarkar

Effect of high-K dielectric on differential conductance and transconductance of ID-DG MOSFET following Ortiz-Conde model

  • Technical Paper

Arpan Deyasi, Angsuman Sarkar, Krishnendu Roy, Anal Roy Chowdhury

Performance analysis of gas sensing device and corresponding IoT framework in mines

  • Technical Paper

Subhrapratim Nath, Anup Dey, Prithviraj Pachal, Jamuna Kanta Sing, Subir Kumar Sarkar

Effect of band non-parabolicity on energy sub-band profile for nano-dimensional MOSFET

  • Technical Paper

Mainak Mukherjee, Manash Chanda, Angshuman Sarkar, Anup Dey

Silicon photovoltaic cell based on graphene oxide as an active layer

  • Technical Paper

Pramila Mahala, Navneet Gupta, Sumitra Singh

Saliency detection via outlier pursuit in compress domain (SDOPCD)

  • Technical Paper

Sujit Das, Jyotsna Kumar Mandal

A 10 nm MOS and its applications

  • Technical Paper

Jyotsna Kumar Mandal, Raktim Chakraborty

Favorable influence of ssDNA-functionalized SWCNT on the navigation pattern of C. elegans

  • Technical Paper

Swati Sinha, Siddharth Shaw, Kunal Biswas, Debashis De, Samir Chandra Das, Angsuman Sarkar, Jaya Bandyopadhyay

Noise analysis of double gate composite InAs based HEMTs for high frequency applications

  • Technical Paper

R. Poornachandran, N. Mohan Kumar, R. Saravana Kumar, S. Baskaran

Design and performance study on a new biaxial micro-accelerometer with variable cross-section beam

  • Technical Paper

Jianghong Sun, Jialin Wang, Keke Gao, Xueping He, Feng Gao, Yufan He, Naizheng Li, Junjian Wang

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Bildnachweise
    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG