Zum Inhalt

Microsystem Technologies

Ausgabe 12/2016

Inhalt (25 Artikel)

Fabrication and packaging of MEMS based platform for hydrogen sensor using ZnO–SnO2 composites

  • Technical Paper

Biplob Mondal, Santanu Maity, Sonali Das, Dipankar Panda, Hiranmay Saha, Avra Kundu

Numerical model of a nanoelectric line from a graphene component

  • Technical Paper

P. Fiala, D. Nešpor, P. Drexler, M. Steinbauer

Periodic material structures tested by the noise spectroscopy method

  • Technical Paper

P. Drexler, J. Seginak, J. Mikulka, D. Nešpor, Z. Szabó, P. Marcoň, P. Fiala

Design and fabrication of differently shaped pyramids on Si{100} by anisotropic wet etching

  • Technical Paper

Kodai Imaeda, Katsuhiko Bessho, Mitsuhiro Shikida

Impact of thermal contact resistances on micro-gap heat losses for microthermionic power generators

  • Technical Paper

Remi Yacine Belbachir, Zhonglie An, Takahito Ono

Design and simulations of a new biaxial silicon resonant micro-accelerometer

  • Technical Paper

Lei Zhao, Bo Dai, Bo Yang, Xiaojun Liu

Glass capillaries based on a glass reflow into nano-trench for controlling light transmission

  • Technical Paper

Nguyen Van Toan, Suguru Sangu, Naoki Inomata, Takahito Ono

Simulation of temperature around laser-heating media in heat-assisted magnetic recording

  • Technical Paper

Guoqing Zhang, Hui Li, Shengnan Shen, Jin Lei, Hao Zheng, Shijing Wu

Electric conduction failure of ACF packages based on pad array aspect ratio consideration

  • Technical Paper

Chao-Ming Lin, Tzu-Chao Lin, Yen-Chun Liu

Structural, optical and electrical properties of Cu2Zn1−xCdxSnS4 quinternary alloys nanostructures deposited on porous silicon

  • Technical Paper

A. S. Ibraheam, Y. Al-Douri, J. M. S. Al-Fhdawi, Hamid S. AL-Jumaili, K. D. Verma, U. Hashim, R. M. Ayub, A. Rahim Ruslinda, M. K. Md Arshad, A. H. Reshak, S. B. Abd Hamid

Numerical analysis of non Newtonian fluid flow in a low voltage cascade electroosmotic micropump

  • Technical Paper

Reza Kamali, Mohammad Karim Dehghan Manshadi, Amin Mansoorifar

Post micromachining of MPW based CMOS–MEMS comb resonator and its mechanical and thermal characterization

  • Technical Paper

John Ojur Dennis, Farooq Ahmad, M. Haris Bin Md Khir, Nor Hisham Bin Hamid

Design and modeling of a novel RF MEMS series switch with low actuation voltage

  • Technical Paper

Khadeijeh Khodadady, Bahram Azizolla Ganji

Vacuum chucking assist sheet for fixing flexible sheets during the printing process

  • Technical Paper

Ken-ichi Nomura, Hirobumi Ushijima, Kengo Noguchi, Noriko Miyaguchi, Takeshi Kobayashi, Masaaki Kawabe

Design and performance analysis of capacitive micromachined ultrasonic transducer (CMUT) array for underwater imaging

  • Technical Paper

Rui Zhang, Chenyang Xue, Changde He, Yongmei Zhang, Jinlong Song, Wendong Zhang

Deformation characteristics of MEMS microspring under static and shock loads

  • Technical Paper

Hua Li, Chaoqun Guo, Yukai Li, Yaobin Chen, Jiancheng Liu, Zhencheng Chen

Improving the dynamic performance of capacitive micro-accelerometer through electrical damping

  • Technical Paper

Wu Zhou, Huijun Yu, Jian Zeng, Bei Peng, Zhi Zeng, Xiaoping He, Yang Liu

Nonlinear effect of disk resonator

  • Technical Paper

Wei Luo, Jicong Zhao, Quan Yuan, Bohua Peng, Jinling Yang, Fuhua Yang

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Bildnachweise
    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG