Ausgabe 2/2015
Inhalt (18 Artikel)
Development of high temperature resistant of 500 °C employing silicon carbide (3C-SiC) based MEMS pressure sensor
- Review Paper
Noraini Marsi, Burhanuddin Yeop Majlis, Azrul Azlan Hamzah, Faisal Mohd-Yasin
Improving voltage output with PZT beam array for MEMS-based vibration energy harvester: theory and experiment
- Technical Paper
Zhiyu Wen, Licheng Deng, Xingqiang Zhao, Zhengguo Shang, Chengwei Yuan, Yin She
Technology of ultralong deep brain fluidic microelectrodes combined with etching-before-grinding
- Technical Paper
Zoltán Fekete
Development of an accurate heat conduction model for micromachined convective accelerometers
- Technical Paper
Brahim Mezghani, F. Tounsi, M. Masmoudi
Modeling the size dependent instability of NEMS sensor/actuator made of nano-wire with circular cross-section
- Technical Paper
Ali Koochi, Amin Farrokhabadi, Mohamadreza Abadyan
Fabrication of polymer electronic boards by ultrasonic embossing and welding
- Technical Paper
Liangyu Cui, Christof Gerhardy, Werner K. Schomburg, Yanling Tian, Dawei Zhang
A protocol for improving fabrication yield of thin SU-8 microcantilevers for use in an aptasensor
- Technical Paper
Yang Choon Lim, Abbas Z. Kouzani, Akif Kaynak, Xiujuan J. Dai, Guy Littlefair, Wei Duan
Comparison of spherical and non-spherical particles in microchannels under dielectrophoretic force
- Technical Paper
Minghao Song, Yu Lei, Hongwei Sun
Choice of insulation materials and its effect on the performance of square microhotplate
- Technical Paper
Gaurav Saxena, Roy Paily
Modeling and analysis of hybrid piezoelectric and electromagnetic energy harvesting from random vibrations
- Technical Paper
Ping Li, Shiqiao Gao, Huatong Cai
Establishment of temperature control scheme for microbioreactor operation using integrated microheater
- Technical Paper
Muhd Nazrul Hisham Zainal Alam, Amir Ali Amiri Moghadam, Abbas Kouzani
Automatic real-time offset calibration of gyroscopes
- Technical Paper
Manuel Glueck, Dayo Oshinubi, Yiannos Manoli
Surface tension-induced PDMS micro-pillars with controllable tips and tilt angles
- Technical Paper
Huawei Li, Yiqiang Fan, David Conchouso, Ian G. Foulds
Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging
- Technical Paper
Zhan Zhan, Lingke Yu, Jin Wei, Cheng Zheng, Daoheng Sun, Lingyun Wang
Nonlocal and strain gradient based model for electrostatically actuated silicon nano-beams
- Technical Paper
Ehsan Maani Miandoab, Aghil Yousefi-Koma, Hossein Nejat Pishkenari
Design and simulation of a novel electro-thermally actuated lateral RF MEMS latching switch for low power applications
- Technical Paper
Elham Pirmoradi, Hadi Mirzajani, Habib Badri Ghavifekr
RF MEMS switches for smart antennas
- Technical Paper
Jitendra Pal, Yong Zhu, Junwei Lu, Dzung Viet Dao, Fahimullah Khan
