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Microsystem Technologies

Ausgabe 3/2013 Special Issue of the 9th High-Aspect-Ratio Micro-Structure Technology Workshop, HARMST 2011, in Hsinchu, Taiwan, June 12-18, 2011

Inhalt (25 Artikel)

Application of photo-etching of polytetrafluoroethylene induced by high energy synchrotron radiation to LIGA

  • Technical Paper

Hideki Kido, Tomoyuki Kuroki, Masaaki Okubo, Yuichi Utsumi

Effect of buffer materials on thermal imprint on plastic optical fiber

  • Technical Paper

Harutaka Mekaru, Akihiro Ohtomo, Hideki Takagi

3D deep X-ray lithography for producing a multi-channel Fourier transform interferometer

  • Technical Paper

Sascha P. Heussler, Herbert O. Moser, S. M. P. Kalaiselvi

Manufacture of a micro-sized piezoelectric ceramic structure using a sacrificial polymer mold insert

  • Technical Paper

Jong Hyun Kim, Si-Young Choi, Jae-Ho Jeon, Geunbae Lim, Suk Sang Chang

Obstacles for cognitive analogy in analysis and synthesis in microsystems development

  • Technical Paper

Albert Albers, Peter Börsting, Sven Matthiesen

Ensuring functional reliability of molded micro components

  • Technical Paper

Albert Albers, Tarak Turki, Philipp Hoppen

A novel fast and low cost replication technology for high-aspect-ratio magnetic microstructures

  • Technical Paper

Xuhan Dai, Xiaodan Miao, Guocheng Shao, Wanjun Wang

A magnetic nano-composite soft polymeric membrane

  • Technical Paper

Akanksha Singh, Mandar Shirolkar, Mukta V. Limaye, Shubha Gokhale, Chantal Khan-Malek, Sulabha K. Kulkarni

BPN a new thick negative photoresist with high aspect ratio for MEMS applications

  • Technical Paper

D. Bourrier, M. Dilhan, A. Ghannam, L. Ourak, H. Granier

Vertical Si nanowire with ultra-high-aspect-ratio by combined top-down processing technique

  • Technical Paper

Jun Nakamura, Kohei Higuchi, Kazusuke Maenaka

Fabrication of flexible light guide plate using CO2 laser LIGA-like technology

  • Technical Paper

C. K. Chung, Y. J. Syu, H. Y. Wang, C. C. Cheng, S. L. Lin, K. Z. Tu

Transparent thin thermoplastic biochip by injection-moulding and laser transmission welding

  • Technical Paper

Akanksha Singh, Wilhelm Pfleging, Markus Beiser, Chantal Khan Malek

Application of the inclined exposure and molding process to fabricate a micro beam-splitter with nanometer roughness

  • Technical Paper

Yun-Ju Chuang, Shih-Hao Huang, Ying-Chuan Chen, Kuo-Yung Hung

Fabrication of two dimensional high aspect ratio polymer photonic crystal laser

  • Technical Paper

Jie Zhou, Gang Liu, Xiaobo Zhang, Xueliang Kang, Ying Xiong, Yangchao Tian

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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