Ausgabe 3/2016 Special issue on design, test, integration and packaging of MEMS/MOEMS: DTIP, Cannes, 2014
Inhalt (27 Artikel)
Special issue on design, test, integration and packaging of MEMS/MOEMS: DTIP, Cannes, 2014
- Editorial
Souhil Megherbi, Bernd Michel
Meter-scale large-area capacitive pressure sensors with fabric with stripe electrodes of conductive polymer-coated fibers
- Technical Paper
Seiichi Takamatsu, Takahiro Yamashita, Toshihiro Itoh
A dual-axis MEMS capacitive inertial sensor with high-density proof mass
- Technical Paper
Daisuke Yamane, Takaaki Matsushima, Toshifumi Konishi, Hiroshi Toshiyoshi, Kazuya Masu, Katsuyuki Machida
Capacitive flexible pressure sensor: microfabrication process and experimental characterization
- Technical Paper
T. H. N. Dinh, E. Martincic, E. Dufour-Gergam, P.-Y. Joubert
Phononic band engineering for thermal conduction control and similarity with photonic band engineering
- Technical Paper
Masahiro Nomura
Reliability characterization of a soot particle sensor in terms of stress- and electromigration in thin-film platinum
- Technical Paper
Radoslav Rusanov, Holger Rank, Tino Fuchs, Roland Mueller-Fiedler, Oliver Kraft
Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
- Technical Paper
A. Lucibello, G. Capoccia, E. Proietti, R. Marcelli, B. Margesin, V. Mulloni, F. Giacomozzi, F. Vitulli, M. Scipioni, G. Bartolucci
Simulation and characterization of dynamic contact in a MEMS passive vibration threshold sensor
- Technical Paper
Zhuoqing Yang, Wenguo Chen, Guifu Ding, Yan Wang, Hong Wang, Xiaolin Zhao
Micro-mixer device with deep channels in silicon using modified RIE process: fabrication, packaging and characterization
- Technical Paper
Saakshi Dhanekar, Sudhir Chandra, R. Balasubramaniam
Simulation of a high-power LED lamp for the evaluation and design of heat dissipation mechanisms
- Technical Paper
De-Shau Huang, Yi-Sheng Liao, Heng-Jen Kuo, Fang-Jui Kuo, Ming-Tzer Lin
The robustness of an algorithm applied in wafer-level material property extraction
- Technical Paper
Wan-Chun Chuang
Design, optimization and simulation of a low-voltage shunt capacitive RF-MEMS switch
- Technical Paper
Li-Ya Ma, Anis Nurashikin Nordin, Norhayati Soin
Characterization of strain microgauges for the monitoring of the deformations of a medical needle during its insertion in human tissues
- Technical Paper
Agnès Bonvilain, Mathilde Gangneron
Robust design optimization of electro-thermal microactuator using probabilistic methods
- Technical Paper
B. Khayatzadeh Safaie, M. Shamshirsaz, M. Bahrami
Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
- Technical Paper
John Brueckner, Alfons Dehé, Ellen Auerswald, Rainer Dudek, Dietmar Vogel, Bernd Michel, Sven Rzepka
Development of thin film based flexible current clamp sensor using screen-printed coil
- Technical Paper
Takahiro Yamashita, Yi Zhang, Toshihiro Itoh, Ryutaro Maeda
Fabrication, simulations, and measurements of self-assembled millimeter-wave antennas for system-on-chip applications
- Technical Paper
Sae-Won Lee, Ying Chen, Diane Titz, Fabien Ferrero, Cyril Luxey, Rodney G. Vaughan, Meenakshinathan Parameswaran
Characterization of capacitive micromachined ultrasonic transducers
- Technical Paper
Fayçal Bellared, Joseph Lardiès, Gilles Bourbon, Patrice Le Moal, Vincent Walter, Marc Berthillier
Microwave atomic force microscope: MG63 osteoblast-like cells analysis on nanometer scale
- Technical Paper
Lan Zhang, Yuanhui Song, Atsushi Hosoi, Yasuyuki Morita, Yang Ju
Fabrication and micromechanical characterization of polycrystalline diamond microcantilevers
- Technical Paper
Maira Possas, Lionel Rousseau, Farbod Ghassemi, Gaelle Lissorgues, Emmanuel Scorsone, Philippe Bergonzo
Bulk metallic glass mold for high volume fabrication of micro optics
- Technical Paper
Peng He, Likai Li, Fei Wang, Olaf Dambon, Fritz Klocke, Katharine M. Flores, Allen Y. Yi
Using MEMS-based inertial sensor with ankle foot orthosis for telerehabilitation and its clinical evaluation in brain injuries and total knee replacement patients
- Technical Paper
Shao-Li Han, Meng-Jie Xie, Chih-Cheng Chien, Yu-Che Cheng, Chia-Wen Tsao
Screen-pad printing for electrode patterning on curvy surfaces
- Technical Paper
Ken-ichi Nomura, Yasuyuki Kusaka, Hirobumi Ushijima, Kazuro Nagase, Hiroaki Ikedo
Low temperature wafer level conformal polymer dielectric spray coating for through silicon vias with 2:1 aspect ratio
- Technical Paper
Yuechen Zhuang, Daquan Yu, Fengwei Dai, Zhongcai Niu
Human breast cancer cell enrichment by Dean flow driven microfluidic channels
- Technical Paper
M. Zuvin, N. Mansur, S. Z. Birol, L. Trabzon, A. Sayı Yazgan
Modeling and test result of closed-loop MEMS accelerometer with wide dynamic range
- Technical Paper
Feng Zhang, Xiangliang Jin, Longsheng Wang
Capacitive solvent sensing with interdigitated microelectrodes
- Technical Paper
Ismail Bilican, Mustafa Tahsin Guler, Neset Gulener, Mustafa Yuksel, Sedat Agan
