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Microsystem Technologies

Ausgabe 3/2017 Special issue on computing, communication and sensor network: CCSN, Puri, Odisha, India, 2014

Inhalt (26 Artikel)

Design of an efficient phase frequency detector to reduce blind zone in a PLL

  • Technical Paper

Umakanta Nanda, Debiprasad Priyabrata Acharya, Sarat Kumar Patra

Ultra high gain CMOS Op-Amp design using self-cascoding and positive feedback

  • Technical Paper

Subhra Chakraborty, Abhishek Pandey, Vijay Nath

Hidden Markov model a tool for recognition of human contexts using sensors of smart mobile phone

  • Technical Paper

Dulal Acharjee, S. P. Maity, Amitava Mukherjee

Wide range-low jitter PLL design for serializer

  • Technical Paper

Jaydip K. Ravia, Mihir V. Shah, Harishanker Gupta, Sanjeev Mehta, Arup Roy Chowdhury

DyProSD: a dynamic protocol specific defense for high-rate DDoS flooding attacks

  • Technical Paper

Debojit Boro, Dhruba K. Bhattacharyya

Enhancing data delivery with density controlled clustering in wireless sensor networks

  • Technical Paper

Gaurang Raval, Madhuri Bhavsar, Nitin Patel

Miniature on-chip band pass filter for RF applications

  • Technical Paper

B. V. N. S. M. Nagesh Deevi, N. Bheema Rao

FPGA based area efficient RS(23, 17) codec

  • Technical Paper

Jagannath Samanta, Jaydeb Bhaumik, Soma Barman

Physical layer design for image transmission between WiMAX/DSRC system

  • Technical Paper

V. Dhilip Kumar, D. Kandar, Babu Sena Paul

Uncooled infrared detector based on silicon diode Wheatstone bridge

  • Technical Paper

Fei Feng, Huihui Zhu, Min Liu, Xudong Wei, Xiaohong Ge, Yuelin Wang, Xinxin Li

Ultrasonic fabrication of micro nozzles from a stack of PVDF foils for generating and characterizing microfluidic dispersions

  • Technical Paper

S. Liao, J. Sackmann, A. Tollkötter, M. Pasterny, N. Kockmann, W. K. Schomburg

Electrical and morphological characterization of platinum thin-films with various adhesion layers for high temperature applications

  • Technical Paper

A. Ababneh, A. N. Al-Omari, A. M. K. Dagamseh, M. Tantawi, C. Pauly, F. Mücklich, D. Feili, H. Seidel

Rice-like CuO nanostructures for sensitive electrochemical sensing of hydrazine

  • Technical Paper

Razium Ali Soomro, Qurratlein Baloach, Aneela Tahira, Zafar Hussain Ibupoto, Ghulam Qadir Khaskheli, Sirajuddin, Vinod Kumar Deewani, Keith Richard Hallam, Kausar Rajar, Magnus Willander

Sandwich structure based on back-side etching silicon (100) wafers for flexible electronic technology

  • Technical Paper

Yong-hua Zhang, Stephen A. Campbell, Liyuan Zhang, Sreejith Karthikeyan

High temperature investigation on a nickel–tin transient liquid-phase wafer bonding up to 600 C

  • Technical Paper

Nando Budhiman, Björn Jensen, Steffen Chemnitz, Bernhard Wagner

Numerical studies on different two-dimensional micromixers basing on a fractal-like tree network

  • Technical Paper

Xueye Chen, Zhen Zhang, Dengli Yi, Zengliang Hu

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