Ausgabe 4/2009
Inhalt (17 Artikel)
Magnetic actuator design for single-axis micro-gyroscopes
Nan-Chyuan Tsai, Wei-Ming Huang, Chao-Wen Chiang
Uniformity study of nickel thin-film microstructure deposited by electroplating
Jia-dong Li, Ping Zhang, Yi-hui Wu, Yong-shun Liu, Ming Xuan
Cross-axis sensitivity reduction of a silicon MEMS piezoresistive accelerometer
A. Ravi Sankar, S. Das, S. K. Lahiri
Fabrication of high-aspect-ratio electrode array by combining UV-LIGA with micro electro-discharge machining
Yang-Yang Hu, D. Zhu, N. S. Qu, Y. B. Zeng, P. M. Ming
Dynamic response of a torsional micromirror to electrostatic force and mechanical shock
Faraz Khatami, Ghader Rezazadeh
Surface micromachined on-chip transformer fabricated on glass substrate
Jumril Yunas, Azrul Azlan Hamzah, Burhanuddin Yeop Majlis
A new way of information storage using red, green, blue and black color imprints
Vamsi Talla, Rahul Sangwan, Arun Chattopadhyay
Design and fabrication of a micro Alvarez lens array with a variable focal length
Chunning Huang, Lei Li, Allen Y. Yi
An experimental and numerical investigation into the effects of the PZT actuator shape in polymethylmethacrylate (PMMA) peristaltic micropumps
Yi-Chu Hsu, Jia-Long Hsu, Ngoc Bich Le
Wafer-level BCB bonding using a thermal press for microfluidics
Xiaodong Zhou, Selven Virasawmy, Chenggen Quan
Numerical analyses of peel demolding for UV embossing of high aspect ratio micro-patterning
L. P. Yeo, S. C. Joshi, Y. C. Lam, Mary B. Chan-Park, D. E. Hardt
A novel study of head motion hysteresis issues in contact probe recording systems
Narayanan Ramakrishnan, Mark D. Bedillion
Improvement of dynamic characteristics of polydimethylsiloxane based microvalve
Gyu-Sik Ra, Sandeep Kumar Jha, Tae-Sik Yoon, Hyun Ho Lee, Yong-Sang Kim
Silicon–glass instrumented solid-phase extraction–zone electrophoresis microchip with thin amorphous silicon film electrodes: performance in immunoaffinity analysis
Ari Hokkanen, Heli Sirén, Lotta K. Amundsen, Kai Kolari, Sami Franssila, Santeri Tuomikoski, Ingmar Stuns, Stella Rovio, Tarja K. Nevanen, Kristiina Takkinen, Hans Söderlund
Electromechanical coupling analysis for MEMS featured by stepped-height structure and concentrated load
Kai Li, Wenyuan Chen, Weiping Zhang, Gaoyin Ma