Ausgabe 4/2011 Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2010
Inhalt (29 Artikel)
Microsystem Technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2010
- Editorial
Bernard Courtois, Bernd Michel
Modeling analysis of a triaxial microaccelerometer with piezoelectric thin-film sensing using energy method
- Technical Paper
Jyh-Cheng Yu, Chungda Lee, Weinan Kuo, Chiaokai Chang
Simulation of maximum power in the wearable thermoelectric generator with a small thermopile
- Technical Paper
Vladimir Leonov
A piezoelectric energy harvester with a mechanical end stop on one side
- Technical Paper
Lars-Cyril Julin Blystad, Einar Halvorsen
A new design for rotational, tunable wideband RF MEMS capacitors
- Technical Paper
Julien Pagazani, Pierre Nicole, Lionel Rousseau, Frédéric Marty, Gaëlle Lissorgues
High-performance MEMS-based gas chromatography column with integrated micro heater
- Technical Paper
Chia-Yen Lee, Chan-Chiung Liu, Shih-Chuan Chen, Che-Ming Chiang, Yu-Hao Su, Wen-Cheng Kuo
Investigation of parallel heat flow path in electro-thermal microsystems
- Technical Paper
Péter G. Szabó, Vladimír Székely
Design, modeling and characterization of stable, high Q-factor curved Fabry–Pérot cavities
- Technical Paper
Maurine Malak, Nicolas Pavy, Frédéric Marty, Elodie Richalot, Ai-Qun Liu, Tarik Bourouina
Modeling and finite element analysis of mechanical behavior of flexible MEMS components
- Technical Paper
Marius Pustan, Stéphane Paquay, Véronique Rochus, Jean-Claude Golinval
Design, simulation and fabrication of piezoelectric micro generators for aero acoustic applications
- Technical Paper
Aliza Aini Md Ralib, Anis Nurashikin Nordin, Raihan Othman, Hanim Salleh
Effect of thermal and mechanical properties variations on microcantilever mass sensor performance
- Technical Paper
M. Maroufi, Sh. Zihajehzadeh, M. Shamshirsaz, A. H. Rezaie
Hot embossing of high performance polymers
- Technical Paper
M. Worgull, A. Kolew, M. Heilig, M. Schneider, H. Dinglreiter, B. Rapp
Technology of microthermoforming of complex three-dimensional parts with multiscale features
- Technical Paper
Markus Heilig, Marc Schneider, Heinz Dinglreiter, Matthias Worgull
New high fill-factor dual-curvature microlens array fabrication using UV proximity printing
- Technical Paper
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao, Shih-Yu Hung, Jen-Sung Hsu
Hot embossing of micro and sub-micro structured inserts for polymer replication
- Technical Paper
Alexander Kolew, Daniel Münch, Karsten Sikora, Matthias Worgull
Roll-to-roll hot embossing of microstructures
- Technical Paper
Thomas Velten, Frank Bauerfeld, Herbert Schuck, Sabine Scherbaum, Christof Landesberger, Karlheinz Bock
Single-cell-based measurement of supraphysiological thermal injury in human carcinoma cells utilizing a micropatterned hydrogel chip
- Technical Paper
Chun-Ping Jen, Ching-Te Huang, Cheng-Han Tsai
Micropatterning of sandwiched FeCuNbSiB/Cu/FeCuNbSiB for the realization of magneto-impedance microsensors
- Technical Paper
Johan Moulin, Marion Woytasik, Iman Shahosseini, Francisco Alves
Identification of dynamic nonlinear thermal transfers for precise correction of bias induced by temperature variations
- Technical Paper
Céline Casenave, Gérard Montseny, Henri Camon, François Blard
Fabrication and characterization of MEMS-based flow sensors based on hot films
- Technical Paper
Rong-Hua Ma, Yu-Hsiang Wang, Sheng-Ling Chiang, Chia-Yen Lee
Fabrication of wireless sensors on flexible film using screen printing and via filling
- Technical Paper
C. W. P. Shi, Xuechuan Shan, G. Tarapata, R. Jachowicz, J. Weremczuk, H. T. Hui
Parametric study of flip-chip packaging for an MEMS device with diaphragm
- Technical Paper
Cheng-Hsin Chuang, Wen-Hui Li, Shin-Li Lee
Leak detection methods for glass capped and polymer sealed MEMS packaging
- Technical Paper
Suzanne Millar, Marc P. Y. Desmulliez, Stewart McCracken
A novel chip-on-glass method for slim LCD packaging
- Technical Paper
You-Hung Lin, Kang J. Chang, Gou-Jen Wang
The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications
- Technical Paper
Wei-Tzuo Lin, De-Shau Huang, Ming-Tzer Lin, Chi-Ming Lai
The use of pulsed laser deposition to produce low-temperature barium titanate films on nickel tape and carbon fiber fabric
- Technical Paper
G. Collins, D. Elam, R. Hackworth, R. Kotha, A. Ayon, A. Chabanov, C. L. Chen
Fabrication of a metal protector for a fiber sensor using through-mask electrochemical micromachining with pulse DC power
- Technical Paper
Wei-Te Wu, Wei-Hung Shih, Chih-To Wang
Structure modification of M-AFM probe for the measurement of local conductivity
- Technical Paper
A. Fujimoto, L. Zhang, A. Hosoi, Y. Ju
Measurement of static and dynamic mechanical behavior of micro and nano-scale thin metal films: using micro-cantilever beam deflection
- Technical Paper
Ya-Chi Cheng, Chi-Jia Tong, Ming-Tzer Lin
