Ausgabe 4/2011
Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2010
Inhalt (29 Artikel)
Microsystem Technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2010
Bernard Courtois, Bernd Michel
Modeling analysis of a triaxial microaccelerometer with piezoelectric thin-film sensing using energy method
Jyh-Cheng Yu, Chungda Lee, Weinan Kuo, Chiaokai Chang
Simulation of maximum power in the wearable thermoelectric generator with a small thermopile
Vladimir Leonov
A piezoelectric energy harvester with a mechanical end stop on one side
Lars-Cyril Julin Blystad, Einar Halvorsen
A new design for rotational, tunable wideband RF MEMS capacitors
Julien Pagazani, Pierre Nicole, Lionel Rousseau, Frédéric Marty, Gaëlle Lissorgues
High-performance MEMS-based gas chromatography column with integrated micro heater
Chia-Yen Lee, Chan-Chiung Liu, Shih-Chuan Chen, Che-Ming Chiang, Yu-Hao Su, Wen-Cheng Kuo
Investigation of parallel heat flow path in electro-thermal microsystems
Péter G. Szabó, Vladimír Székely
Design, modeling and characterization of stable, high Q-factor curved Fabry–Pérot cavities
Maurine Malak, Nicolas Pavy, Frédéric Marty, Elodie Richalot, Ai-Qun Liu, Tarik Bourouina
Modeling and finite element analysis of mechanical behavior of flexible MEMS components
Marius Pustan, Stéphane Paquay, Véronique Rochus, Jean-Claude Golinval
Design, simulation and fabrication of piezoelectric micro generators for aero acoustic applications
Aliza Aini Md Ralib, Anis Nurashikin Nordin, Raihan Othman, Hanim Salleh
Effect of thermal and mechanical properties variations on microcantilever mass sensor performance
M. Maroufi, Sh. Zihajehzadeh, M. Shamshirsaz, A. H. Rezaie
Hot embossing of high performance polymers
M. Worgull, A. Kolew, M. Heilig, M. Schneider, H. Dinglreiter, B. Rapp
Technology of microthermoforming of complex three-dimensional parts with multiscale features
Markus Heilig, Marc Schneider, Heinz Dinglreiter, Matthias Worgull
New high fill-factor dual-curvature microlens array fabrication using UV proximity printing
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao, Shih-Yu Hung, Jen-Sung Hsu
Hot embossing of micro and sub-micro structured inserts for polymer replication
Alexander Kolew, Daniel Münch, Karsten Sikora, Matthias Worgull
Roll-to-roll hot embossing of microstructures
Thomas Velten, Frank Bauerfeld, Herbert Schuck, Sabine Scherbaum, Christof Landesberger, Karlheinz Bock
Single-cell-based measurement of supraphysiological thermal injury in human carcinoma cells utilizing a micropatterned hydrogel chip
Chun-Ping Jen, Ching-Te Huang, Cheng-Han Tsai
Micropatterning of sandwiched FeCuNbSiB/Cu/FeCuNbSiB for the realization of magneto-impedance microsensors
Johan Moulin, Marion Woytasik, Iman Shahosseini, Francisco Alves
Identification of dynamic nonlinear thermal transfers for precise correction of bias induced by temperature variations
Céline Casenave, Gérard Montseny, Henri Camon, François Blard
Fabrication and characterization of MEMS-based flow sensors based on hot films
Rong-Hua Ma, Yu-Hsiang Wang, Sheng-Ling Chiang, Chia-Yen Lee
Fabrication of wireless sensors on flexible film using screen printing and via filling
C. W. P. Shi, Xuechuan Shan, G. Tarapata, R. Jachowicz, J. Weremczuk, H. T. Hui
Parametric study of flip-chip packaging for an MEMS device with diaphragm
Cheng-Hsin Chuang, Wen-Hui Li, Shin-Li Lee
Leak detection methods for glass capped and polymer sealed MEMS packaging
Suzanne Millar, Marc P. Y. Desmulliez, Stewart McCracken
A novel chip-on-glass method for slim LCD packaging
You-Hung Lin, Kang J. Chang, Gou-Jen Wang
The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications
Wei-Tzuo Lin, De-Shau Huang, Ming-Tzer Lin, Chi-Ming Lai
The use of pulsed laser deposition to produce low-temperature barium titanate films on nickel tape and carbon fiber fabric
G. Collins, D. Elam, R. Hackworth, R. Kotha, A. Ayon, A. Chabanov, C. L. Chen
Fabrication of a metal protector for a fiber sensor using through-mask electrochemical micromachining with pulse DC power
Wei-Te Wu, Wei-Hung Shih, Chih-To Wang
Structure modification of M-AFM probe for the measurement of local conductivity
A. Fujimoto, L. Zhang, A. Hosoi, Y. Ju
Measurement of static and dynamic mechanical behavior of micro and nano-scale thin metal films: using micro-cantilever beam deflection
Ya-Chi Cheng, Chi-Jia Tong, Ming-Tzer Lin