Ausgabe 5/2010 Special Issue of the Conference ‘Smart Sensors, Actuators and MEMS’, within the SPIE Europe Symposium ‘Microtechnologies for the New Millennium’ Dresden, Germany, 4–6 May 2009
Inhalt (28 Artikel)
Special Issue of the Conference ‘Smart Sensors, Actuators and MEMS’, within the SPIE Europe Symposium ‘Microtechnologies for the New Millennium’ Dresden, Germany, 4–6 May 2009
- Editorial
Thomas Becker, Ulrich Schmid, Bernd Michel
Vibration energy scavenging via piezoelectric bimorphs of optimized shapes
- Technical Paper
Denis Benasciutti, Luciano Moro, Saša Zelenika, Eugenio Brusa
Growth of ZnO nanorods on patterned templates for efficient, large-area energy scavengers
- Technical Paper
G. Niarchos, E. Makarona, C. Tsamis
Magnetic resonant harvesters and power management circuit for magnetic resonant harvesters
- Technical Paper
Tomáš Jirků, Pavel Fiala, Martin Kluge
Power sensitivity of vibration energy harvester
- Technical Paper
Zdenek Hadas, Cestmir Ondrusek, Vladislav Singule
Piezoresistive biochemical sensors based on hydrogels
- Technical Paper
Margarita Guenther, Gerald Gerlach, Thomas Wallmersperger
Gel-based biochip for the detection of airborne contaminants
- Technical Paper
Katrin Schmitt, Gerd Sulz, Thorsten Klockenbring, Björn Seidel, Andreas Holländer
Manufacturing, assembling and packaging of miniaturized neural implants
- Technical Paper
Thomas Stieglitz
Adsorption–desorption noise in plasmonic chemical/biological sensors for multiple analyte environment
- Technical Paper
Olga Jakšić, Zoran Jakšić, Jovan Matović
Fast transient temperature operating micromachined emitter for mid-infrared optical gas sensing systems: design, fabrication, characterization and optimization
- Technical Paper
J. Hildenbrand, C. Peter, F. Lamprecht, A. Kürzinger, F. Naumann, M. Ebert, R. Wehrspohn, J. G. Korvink, J. Wöllenstein
A comparative analyze of fundamental noise in cantilever sensors based on lateral and longitudinal displacement: case of thermal infrared detectors
- Technical Paper
Jovan Matović, Zoran Jakšić
Tactile sensors based on conductive polymers
- Technical Paper
Julián Castellanos-Ramos, Rafael Navas-González, Haritz Macicior, Tomasz Sikora, Estíbalitz Ochoteco, Fernando Vidal-Verdú
A dynamical envelope model for vibratory gyroscopes
- Technical Paper
Markus Egretzberger, Andreas Kugi
MEMS fluxgate magnetometer for parallel robot application
- Technical Paper
Maren Ramona Kirchhoff, Stephanus Büttgenbach
High-resolution eddy current sensor system for quality assessment of carbon fiber materials
- Technical Paper
Martin H. Schulze, Henning Heuer, Martin Küttner, Norbert Meyendorf
Adhesive wafer bonding with photosensitive polymers for MEMS fabrication
- Technical Paper
Erkan Cakmak, Viorel Dragoi, Elliott Capsuto, Craig McEwen, Eric Pabo
Influence of a chip scale package on the frequency response of a MEMS microphone
- Technical Paper
Matthias Winter, Gregor Feiertag, Anton Leidl, Helmut Seidel
Flip chip packaging for MEMS microphones
- Technical Paper
Gregor Feiertag, Matthias Winter, Anton Leidl
Study on microstructural, chemical and electrical properties of tantalum nitride thin films deposited by reactive direct current magnetron sputtering
- Technical Paper
Michaela Grosser, M. Münch, J. Brenner, M. Wilke, H. Seidel, C. Bienert, A. Roosen, U. Schmid
Analysis of the quality factor of AlN-actuated micro-resonators in air and liquid
- Technical Paper
Tomás Manzaneque, J. Hernando, L. Rodríguez-Aragón, A. Ababneh, H. Seidel, U. Schmid, J. L. Sánchez-Rojas
Robust miniaturized amplification unit for piezoelectric actuators: comparison of single crystal silicon and superelastic nickel titanium as membrane materials
- Technical Paper
Christian Bolzmacher, Karin Bauer, Ulrich Schmid, Moustapha Hafez, Helmut Seidel
Characterization and displacement control of low surface-stress AlN-based piezoelectric micro-resonators
- Technical Paper
Jorge Hernando, Jose Luis Sánchez-Rojas, Ulrich Schmid, Abdallah Ababneh, Günter Marchand, Helmut Seidel
Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process
- Technical Paper
Ü. Sökmen, A. Stranz, S. Fündling, S. Merzsch, R. Neumann, H.-H. Wehmann, E. Peiner, A. Waag
What happens turning a 250-μm-thin piezo-stack sideways?
- Technical Paper
Sandy Zaehringer, Norbert Schwesinger
Novel measurement and monitoring system for forming processes based on piezoresistive thin film systems
- Technical Paper
Saskia Biehl, Sebastian Staufenbiel, Frank Hauschild, André Albert
Design of self-assembling micromirror arrays for light guiding applications
- Technical Paper
Qingdang Li, Andreas Jäkel, Volker Viereck, Hartmut Hillmer
MOEMS translatory actuator characterisation, position encoding and closed-loop control
- Technical Paper
M. Lenzhofer, A. Tortschanoff, A. Frank, T. Sandner, H. Schenk, M. Kraft, A. Kenda
