Microsystem Technologies

Special issue on WaferBond‘11

• Editorial

Direct bonding of titanium layers on silicon

• Technical Paper

F. Baudin, L. Di Cioccio, V. Delaye, N. Chevalier, J. Dechamp, H. Moriceau, E. Martinez, Y. Bréchet

Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes

• Technical Paper

Christian Goßler, Michael Kunzer, Mario Baum, Maik Wiemer, Rüdiger Moser, Thorsten Passow, Klaus Köhler, Ulrich T. Schwarz, Joachim Wagner

Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

• Technical Paper

J. Fan, D. F. Lim, L. Peng, K. H. Li, C. S. Tan

Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packaging

• Technical Paper

Anselm Wissinger, Alexander Olowinsky, Arnold Gillner, Reinhart Poprawe

Hydrophobic direct bonding of silicon reconstructed surfaces

• Technical Paper

C. Rauer, F. Rieutord, J. M. Hartmann, A.-M. Charvet, F. Fournel, D. Mariolle, C. Morales, H. Moriceau

Room temperature bonding for vacuum applications: climatic and long time tests

• Technical Paper

S. Langa, J. Utsumi, T. Ludewig, C. Drabe

Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy

• Technical Paper

Falk Naumann, Sebastian Brand, Michael Bernasch, Sebastian Tismer, Peter Czurratis, Dirk Wünsch, Matthias Petzold

Characterization of bonded wafer stacks by use of the photoelastic-analysis-method

• Technical Paper

H. Geiler, K. Schulz, R. Knechtel

The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers

• Technical Paper

V. Masteika, J. Kowal, N. St. J. Braitwaite, T. Rogers

Optimization of MEMS capacitive accelerometer

• Open Access
• Review Paper

Mourad Benmessaoud, Mekkakia Maaza Nasreddine

Thermoelastic dissipation in stepped-beam resonators

• Technical Paper

K. Tunvir

A circular microchannel with integrated electrodes for DNA electrophoresis

• Technical Paper

B. Lerner, P. A. Kler, A. F. Ordoñez Arias, M. S. Perez, C. Lasorsa, C. L. A. Berli

Patterning of carbon nanotube films on PDMS using SU-8 microstructures

• Technical Paper

Dongil Kim, Kwang-Seok Yun

An adsorption-based mercury sensor with continuous readout

• Technical Paper

Milija Sarajlić, Zoran G. Đurić, Vesna B. Jović, Srđan P. Petrović, Dragana S. Đorđević

Void-free trench isolation based on a new trench design

• Technical Paper

Xiao-Ying Li, Guang-Tao Li, Sen Ren, Da-Yong Qiao

A novel movable electrode for realizing deep sub-micrometer gap in SOI-based MEMS square resonator

• Technical Paper

J. W. Jiang, J. F. Bao, Y. J. Du, C. Deng