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Microsystem Technologies

Ausgabe 5/2013

Special section on WaferBond‘11, ‘‘International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration’’

Inhalt (17 Artikel)

Technical Paper

Direct bonding of titanium layers on silicon

F. Baudin, L. Di Cioccio, V. Delaye, N. Chevalier, J. Dechamp, H. Moriceau, E. Martinez, Y. Bréchet

Technical Paper

Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes

Christian Goßler, Michael Kunzer, Mario Baum, Maik Wiemer, Rüdiger Moser, Thorsten Passow, Klaus Köhler, Ulrich T. Schwarz, Joachim Wagner

Technical Paper

Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packaging

Anselm Wissinger, Alexander Olowinsky, Arnold Gillner, Reinhart Poprawe

Technical Paper

Hydrophobic direct bonding of silicon reconstructed surfaces

C. Rauer, F. Rieutord, J. M. Hartmann, A.-M. Charvet, F. Fournel, D. Mariolle, C. Morales, H. Moriceau

Technical Paper

Room temperature bonding for vacuum applications: climatic and long time tests

S. Langa, J. Utsumi, T. Ludewig, C. Drabe

Technical Paper

Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy

Falk Naumann, Sebastian Brand, Michael Bernasch, Sebastian Tismer, Peter Czurratis, Dirk Wünsch, Matthias Petzold

Open Access Review Paper

Optimization of MEMS capacitive accelerometer

Mourad Benmessaoud, Mekkakia Maaza Nasreddine

Technical Paper

A circular microchannel with integrated electrodes for DNA electrophoresis

B. Lerner, P. A. Kler, A. F. Ordoñez Arias, M. S. Perez, C. Lasorsa, C. L. A. Berli

Technical Paper

An adsorption-based mercury sensor with continuous readout

Milija Sarajlić, Zoran G. Đurić, Vesna B. Jović, Srđan P. Petrović, Dragana S. Đorđević

Technical Paper

Void-free trench isolation based on a new trench design

Xiao-Ying Li, Guang-Tao Li, Sen Ren, Da-Yong Qiao

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