Ausgabe 5/2013
Special section on WaferBond‘11, ‘‘International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration’’
Inhalt (17 Artikel)
Special issue on WaferBond‘11
Direct bonding of titanium layers on silicon
F. Baudin, L. Di Cioccio, V. Delaye, N. Chevalier, J. Dechamp, H. Moriceau, E. Martinez, Y. Bréchet
Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes
Christian Goßler, Michael Kunzer, Mario Baum, Maik Wiemer, Rüdiger Moser, Thorsten Passow, Klaus Köhler, Ulrich T. Schwarz, Joachim Wagner
Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration
J. Fan, D. F. Lim, L. Peng, K. H. Li, C. S. Tan
Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packaging
Anselm Wissinger, Alexander Olowinsky, Arnold Gillner, Reinhart Poprawe
Hydrophobic direct bonding of silicon reconstructed surfaces
C. Rauer, F. Rieutord, J. M. Hartmann, A.-M. Charvet, F. Fournel, D. Mariolle, C. Morales, H. Moriceau
Room temperature bonding for vacuum applications: climatic and long time tests
S. Langa, J. Utsumi, T. Ludewig, C. Drabe
Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Falk Naumann, Sebastian Brand, Michael Bernasch, Sebastian Tismer, Peter Czurratis, Dirk Wünsch, Matthias Petzold
Characterization of bonded wafer stacks by use of the photoelastic-analysis-method
H. Geiler, K. Schulz, R. Knechtel
The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers
V. Masteika, J. Kowal, N. St. J. Braitwaite, T. Rogers
Optimization of MEMS capacitive accelerometer
Mourad Benmessaoud, Mekkakia Maaza Nasreddine
A circular microchannel with integrated electrodes for DNA electrophoresis
B. Lerner, P. A. Kler, A. F. Ordoñez Arias, M. S. Perez, C. Lasorsa, C. L. A. Berli
Patterning of carbon nanotube films on PDMS using SU-8 microstructures
Dongil Kim, Kwang-Seok Yun
An adsorption-based mercury sensor with continuous readout
Milija Sarajlić, Zoran G. Đurić, Vesna B. Jović, Srđan P. Petrović, Dragana S. Đorđević
Void-free trench isolation based on a new trench design
Xiao-Ying Li, Guang-Tao Li, Sen Ren, Da-Yong Qiao
A novel movable electrode for realizing deep sub-micrometer gap in SOI-based MEMS square resonator
J. W. Jiang, J. F. Bao, Y. J. Du, C. Deng