Ausgabe 5/2015 Special issue on WaferBond’13 “International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration”
Inhalt (25 Artikel)
Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films
- Technical Paper
E. Beche, F. Fournel, V. Larrey, F. Rieutord, F. Fillot
Mechanism involved in direct hydrophobic Si(100)-2×1:H bonding
- Technical Paper
C. Rauer, H. Moriceau, F. Rieutord, J. M. Hartmann, F. Fournel, A. M. Charvet, N. Bernier, N. Rochat, H. Dansas, D. Mariolle, C. Morales
Modelling of the direct bonding wave
- Technical Paper
Damien Radisson, Frank Fournel, Elisabeth Charlaix
Mechanical understanding of 100 mm InP and GaAs direct bonded heterostructure
- Technical Paper
B. Imbert, X. Blot, A. Tauzin, T. Salvetat, E. Lagoutte, C. Lecouvey, T. Chaira, V. Larrey, C. Bridoux, F. Fournel, V. Delaye, A.-M. Papon, H. Moriceau, V. Carron
Conductivity of high-temperature annealed silicon direct wafer bonds
- Technical Paper
Kari Schjølberg-Henriksen, Lars Geir Whist Tvedt, Stein Are Gjelstad, Christopher Mørk, Sigurd T. Moe, Kristin Imenes, Erik Poppe, Dag T. Wang
Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology
- Technical Paper
P. Montméat, T. Enot, M. Pellat, F. Fournel, L. Bally, L. Baud, J. Dechamp, R. Eleouet, L. Vignoud, M. Zussy
Kinetics of low temperature direct copper–copper bonding
- Technical Paper
P. Gondcharton, B. Imbert, L. Benaissa, V. Carron, M. Verdier
Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation
- Technical Paper
B. Rebhan, S. Tollabimazraehno, G. Hesser, V. Dragoi
UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding
- Technical Paper
P. Anantha, C. S. Tan
Wafer level vacuum packaging of micro-mirrors with buried signal lines
- Technical Paper
S. Langa, C. Drabe, A. Herrmann, T. Ludewig, A. Rieck, A. Flemming, C. Kaden
Silicon–ceramic–silicon-wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficient
- Technical Paper
S. Günschmann, M. Fischer, H. Mannebach, J. Steffensky, J. Müller
Laser welding of sapphire wafers using a thin-film fresnoite glass solder
- Technical Paper
Araceli de Pablos-Martín, M. Ebert, C. Patzig, M. Krause, M. Dyrba, P. Miclea, M. Lorenz, M. Grundmann, Th. Höche
Design of compact and wide bandwidth SPDT with anti-stiction torsional RF MEMS series capacitive switch
- Technical Paper
Deepak Bansal, Amit Kumar, Akshdeep Sharma, K. J. Rangra
Fabrication and characterization of MEMS piezoelectric synthetic jet actuators with bulk-micromachined PZT thick film
- Technical Paper
Shushan Wang, Binghe Ma, Jinjun Deng, Hongdong Qu, Jian Luo
The on-chip temperature compensation and temperature control research for the silicon micro-gyroscope
- Technical Paper
Bo Yang, Bo Dai, Xiaojun Liu, Lu Xu, Yunpeng Deng, Xingjun Wang
A complete analytical model for circular diaphragm pressure sensor with freely supported edge
- Technical Paper
Sumit Kumar Jindal, Sanjeev Kumar Raghuwanshi
Small modified printed planar ultrawide band disc antennas with etched ground plane
- Technical Paper
G. Sasibhushana Rao, S. Srinivasa Kumar, Ramu Pillalamarri
Wide-band millimetre-wave antenna based on Si and suspended BCB membrane
- Technical Paper
Seonho Seok, Janggil Kim, Hassan Salti, Laurent Dussopt, Nathalie Rolland
Fabrication and characterization of a dry electrode integrated Gecko-inspired dry adhesive medical patch for long-term ECG measurement
- Technical Paper
Long-Fei Wang, Jing-Quan Liu, Bin Yang, Xiang Chen, Chun-Sheng Yang
Local thermal-assisted ultrasonic embossing for the fabrication of polymer microstructures
- Technical Paper
Na Qi, Yi Luo, Xiao-dong Wang, Li-ding Wang, Zong-bo Zhang
The plastic and creep characteristics of silicon microstructure at elevated temperature
- Technical Paper
Shaokang Yao, Dehui Xu, Bin Xiong, Yuelin Wang
Development of a novel microviscosity model based on molecular chain length
- Technical Paper
Yan Lou, Jiulong Pei, Peiqian He, Xiaoyu Wu
Fabrication of miniature parts using nano-sized powders and an environmentally friendly binder through micro powder injection molding
- Technical Paper
Javad Rajabi, Hafizawati Zakaria, Norhamidi Muhamad, Abu Bakar Sulong, Abdolali Fayyaz
